公开(公告)号：US5472735A

公开(公告)日：1995-12-05

申请号：US351819

申请日：1994-12-08

申请人： Christina M. Boyko ,  Richard W. Carpenter ,  Raymond T. Galasco ,  Krystyna W. Semkow ,  Herbert Wegener

发明人： Christina M. Boyko ,  Richard W. Carpenter ,  Raymond T. Galasco ,  Krystyna W. Semkow ,  Herbert Wegener

IPC分类号： C25F3/02 ,  H05K3/07 ,  B05D5/12 ,  C25D5/34 ,  C25F3/14

CPC分类号： H05K3/07 ,  C25F3/02 ,  H05K2203/1152 ,  Y10S204/07

摘要： The present invention relates to a method for selectively electroetching a metal from an electrical device having the steps of: immersing the electrical device in an etching solution; immersing a cathode in the etching solution; applying an etching potential to a preselected area of the metal; and maintaining a passivation potential at the metal to remain unetched. The metal to remain unetched is not electrically connected to the preselected area and the passivation potential does not equal the etching potential.The present invention further relates to a method of forming an electrical connection to the inner layers of a multilayer circuit board having a copper foil surface layer and copper containing inner layers.

摘要翻译： 本发明涉及一种从电气设备中选择性地电蚀金属的方法，其特征在于具有以下步骤：将电气设备浸入蚀刻液中; 将阴极浸入蚀刻溶液中; 将蚀刻电位施加到金属的预选区域; 并且保持在金属处的钝化电位以保持未蚀刻。 保持未蚀刻的金属不与预选区域电连接，并且钝化电势不等于蚀刻电位。 本发明还涉及一种形成与具有铜箔表面层和含铜内层的多层电路板的内层的电连接的方法。

公开(公告)号：US5374338A

公开(公告)日：1994-12-20

申请号：US143819

申请日：1993-10-27

申请人： Christina M. Boyko ,  Richard W. Carpenter ,  Raymond T. Galasco ,  Krystyna W. Semkow ,  Herbert Wegener

发明人： Christina M. Boyko ,  Richard W. Carpenter ,  Raymond T. Galasco ,  Krystyna W. Semkow ,  Herbert Wegener

IPC分类号： C25F3/02 ,  H05K3/07 ,  C25F3/04 ,  C25F3/06 ,  C25F3/14

CPC分类号： H05K3/07 ,  C25F3/02 ,  H05K2203/1152 ,  Y10S204/07

摘要： The present invention relates to a method for selectively electroetching a metal from an electrical device having the steps of: immersing the electrical device in an etching solution; immersing a cathode in the etching solution; applying an etching potential to a preselected area of the metal; and maintaining a passivation potential at the metal to remain unetched. The metal to remain unetched is not electrically connected to the preselected area and the passivation potential does not equal the etching potential.The present invention further relates to a method of forming an electrical connection to the inner layers of a multilayer circuit board having a copper foil surface layer and copper containing inner layers.

摘要翻译： 本发明涉及一种从电气设备中选择性地电蚀金属的方法，其特征在于具有以下步骤：将电气设备浸入蚀刻液中; 将阴极浸入蚀刻溶液中; 将蚀刻电位施加到金属的预选区域; 并且保持在金属处的钝化电位以保持未蚀刻。 保持未蚀刻的金属不与预选区域电连接，并且钝化电势不等于蚀刻电位。 本发明还涉及一种形成与具有铜箔表面层和含铜内层的多层电路板的内层的电连接的方法。