发明授权
US5506178A Process for forming gate silicon oxide film for MOS transistors 失效
用于形成用于MOS晶体管的栅氧化硅膜的工艺

Process for forming gate silicon oxide film for MOS transistors
摘要:
A process for forming a silicon oxide film comprising:(a) heat treating a semiconductor substrate at a temperature of 1,150.degree. C. or higher under a 100% hydrogen gas atmosphere for a period of 10 to 600 minutes; and(b) forming a silicon oxide film on the semiconductor substrate by wet oxidation, followed by heat treating said silicon oxide film under an inert gas atmosphere containing a halogen element.
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