Invention Grant
- Patent Title: Soldering method and apparatus for use in connecting electronic circuit devices
- Patent Title (中): 用于连接电子电路装置的焊接方法和装置
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Application No.: US235909Application Date: 1994-05-02
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Publication No.: US5516031APublication Date: 1996-05-14
- Inventor: Toru Nishikawa , Masahito Ijuin , Ryohei Sato , Mitsugu Shirai
- Applicant: Toru Nishikawa , Masahito Ijuin , Ryohei Sato , Mitsugu Shirai
- Applicant Address: JPX Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX5-115916 19930518
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K1/008 ; B23K1/20 ; H01L21/48 ; H01L21/56 ; H01L21/60 ; H01L21/68 ; H01L23/498 ; H05K3/34 ; B23K3/08
Abstract:
In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.
Public/Granted literature
- US6036309A Temple structure for a pair of eyeglasses Public/Granted day:2000-03-14
Information query
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