公开(公告)号：US5516031A

公开(公告)日：1996-05-14

申请号：US235909

申请日：1994-05-02

Applicant: Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

Inventor： Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K3/08

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/75272 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

Abstract: In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

Abstract translation: 为了通过无焊接方法及其设备通过溅射蚀刻来对应于其通过溅射蚀刻的焊接和焊接材料的焊接材料的焊接和焊接材料上的氧化膜和污染膜去除氧化物膜和污染膜，在溅射蚀刻下从焊料材料发射的物质使用 检测并确定原子或离子是来自焊料材料还是来自其上的氧化物膜。 基于去除氧化膜的测定来控制溅射蚀刻。 然后，将构件在氧化气氛中排列并在非氧化气氛中焊接。

公开(公告)号：US06795105B2

公开(公告)日：2004-09-21

申请号：US10095577

申请日：2002-03-13

Applicant: Kaoru Katayama ,  Kenichi Inoue ,  Mitsugu Shirai ,  Tsutomu Sakamoto

Inventor： Kaoru Katayama ,  Kenichi Inoue ,  Mitsugu Shirai ,  Tsutomu Sakamoto

IPC: B41J245

CPC classification number: B41M5/262 ,  B41M5/26 ,  H05K1/0266

Abstract: A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.

Abstract translation: 激光打印装置由激光振荡器10，用于扫描从激光振荡器10发射的激光的电流镜42,44以及用于将从激光振荡器10发射的激光聚焦在MCC32,34上的焦距透镜40 作为要印刷的成员。 激光振荡器10是发射紫外线范围内的三次谐波的激光的YLF激光振荡器。 通过使用从激光振荡器10发射的激光，作为要打印的构件的MCC 32,34进行激光打印。

公开(公告)号：US06533162B2

公开(公告)日：2003-03-18

申请号：US09733096

申请日：2000-12-11

Applicant: Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

Inventor： Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

IPC: B23K3102

CPC classification number: H05K3/3484 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2203/0143

Abstract: An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste. Parts are loaded on the through holes and lands of the printed circuit board loaded with solder paste and reflowing is carried out on the printed circuit board and paste receiving plate at the same time, so that the lead provided parts and surface mounting parts are soldered to the printed circuit board at the same time.

Abstract translation: 一种改进的焊接系统，其减少了在焊接引线中的糊料供应和焊接的步骤数量，将部件和表面安装部件提供到印刷电路板上。 印刷电路板具有通孔，每个引线设置部分的引线将被插入，并且用于表面安装部件的平台。 印刷掩模与通孔和焊盘匹配，并且设置具有孔的糊状物接收板，相应于每个通孔向其供应焊膏。 通过将印刷辊强制旋转以便填充焊膏，然后在该印刷辊之后扫描印刷刮板，以进一步填充焊膏。 部件装载在装载有焊锡膏的印刷电路板的通孔和平台上，并且同时在印刷电路板和糊状物接收板上进行回流，使得引线提供部件和表面安装部件被焊接到 印刷电路板同时进行。

公开(公告)号：US06471115B1

公开(公告)日：2002-10-29

申请号：US09585391

申请日：2000-06-02

Applicant: Masahito Ijuin ,  Toru Nishikawa ,  Ryohei Sato ,  Mitsugu Shirai ,  Yuzo Taniguchi ,  Kosuke Inoue ,  Masahide Harada ,  Tetsuya Hayashida

Inventor： Masahito Ijuin ,  Toru Nishikawa ,  Ryohei Sato ,  Mitsugu Shirai ,  Yuzo Taniguchi ,  Kosuke Inoue ,  Masahide Harada ,  Tetsuya Hayashida

IPC: B23K3102

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81012 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H05K3/3489 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

Abstract translation: 本发明是一种通过将焊料材料涂布在印刷电路板上的电子部件或电极上来制造电子电路器件的方法; 该方法包括以下步骤：从焊料材料和电极的表面去除初始表面氧化物膜和有机污染膜，覆盖焊料材料和由电极组成的焊料区域， 在熔化焊料材料的步骤中完成接合之后的液体蒸发，从而防止接合区域表面的再氧化，并且使焊料材料加热熔化，而不使用任何焊剂进行焊接。

公开(公告)号：US06193144B1

公开(公告)日：2001-02-27

申请号：US09102212

申请日：1998-06-22

Applicant: Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

Inventor： Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

IPC: B23K500

CPC classification number: H05K3/3484 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2203/0143

Abstract: An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste. Parts are loaded on the through holes and lands of the printed circuit board loaded with solder paste and reflowing is carried out on the printed circuit board and paste receiving plate at the same time, so that the lead provided parts and surface mounting parts are soldered to the printed circuit board at the same time.

Abstract translation: 一种改进的焊接系统，其减少了在焊接引线中的糊料供应和焊接的步骤数量，将部件和表面安装部件提供到印刷电路板上。 印刷电路板具有通孔，每个引线设置部分的引线将被插入，并且用于表面安装部件的平台。 印刷掩模与通孔和焊盘匹配，并且设置具有孔的糊状物接收板，相应于每个通孔向其供应焊膏。 通过将印刷辊强制旋转以便填充焊膏，然后在该印刷辊之后扫描印刷刮板，以进一步填充焊膏。 部件装载在装载有焊锡膏的印刷电路板的通孔和平台上，同时在印刷电路板和糊状物接收板上进行回流，使得引线提供部件和表面安装部件被焊接到 印刷电路板同时进行。

公开(公告)号：US6137687A

公开(公告)日：2000-10-24

申请号：US487171

申请日：2000-01-19

Applicant: Mitsugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Keiji Fujikawa ,  Makoto Matsuoka

Inventor： Mitsugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Keiji Fujikawa ,  Makoto Matsuoka

IPC: H01L23/498 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/4664 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2924/01322 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.

Abstract translation: 在制造印刷电路板的方法中，该印刷电路板可以通过在短时间内以低成本执行简单的制造步骤而不需要复杂的制造工艺来制造。 将导电材料图案印刷在基板上，并且印刷的导电材料被硬化以形成第一导体层。 随后，将绝缘材料图案印刷在第一导体层上，并且印刷的绝缘材料被硬化从而形成第一绝缘层。 重复执行类似于上述步骤的制造步骤，从而形成第二导体层，第二绝缘层和第三导体层。 此外，重复进行与上述步骤类似的制造步骤，从而可以制造具有多导体层的印刷电路板。

公开(公告)号：US5973406A

公开(公告)日：1999-10-26

申请号：US918019

申请日：1997-08-25

Applicant: Masahide Harada ,  Toru Nishikawa ,  Ryohei Satoh ,  Osamu Yamada ,  Takayuki Uda ,  Mitsugu Shirai

Inventor： Masahide Harada ,  Toru Nishikawa ,  Ryohei Satoh ,  Osamu Yamada ,  Takayuki Uda ,  Mitsugu Shirai

IPC: H01L21/60 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/81 ,  H05K3/3436 ,  H01L2224/13111 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/086 ,  Y02P70/613

Abstract: An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.

Abstract translation: 无需使用焊剂即可正确焊接电子设备，也不会对基板进行精确定位。 在要安装电子装置的基板上的区域中形成尺寸约为电子装置的端子焊盘尺寸的两倍的焊盘。 在放置基板表面的电子装置之后，将整个单元在氮气气氛中加热以熔化形成在电子装置的端子板上的凸块。 熔融的焊料润湿并扩散在形成在衬底上的接合焊盘上，从而在接合焊盘和端子焊盘之间建立回流焊接。 电子器件相对于衬底的位置由于通过在衬底的焊盘上的熔融焊料的润湿和扩散而引起的自对准功能自发校正。

公开(公告)号：US5551148A

公开(公告)日：1996-09-03

申请号：US330569

申请日：1994-10-28

Applicant: Shinichi Kazui ,  Makoto Matsuoka ,  Hideyuki Fukasawa ,  Mitsunori Tamura ,  Mitsugu Shirai ,  Hideaki Sasaki

Inventor： Shinichi Kazui ,  Makoto Matsuoka ,  Hideyuki Fukasawa ,  Mitsunori Tamura ,  Mitsugu Shirai ,  Hideaki Sasaki

IPC: H01L21/60 ,  H01L21/48 ,  H05K3/34 ,  H05K3/00

CPC classification number: H05K3/3478 ,  H01L21/4853 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2924/01068 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0769 ,  Y10T29/49149 ,  Y10T29/4981

Abstract: A flexible film-like member having conductive metals filled in tapered holes extending through the thickness is positioned such that the holes of the member face to respective pad patterns on a circuit board on which bumps are to be formed, the conductive metals are then heated and fused so that they are joined and transferred to the pad patterns on the circuit board, and the film-like member is then removed by heating or cleaning liquid.

Abstract translation: 具有填充在贯穿厚度的锥形孔中的导电金属的柔性膜状构件被定位成使得构件的孔面对要在其上形成凸块的电路板上的相应焊盘图案，然后导电金属被加热，并且 熔融，使其接合并转移到电路板上的焊盘图案，然后通过加热或清洗液体除去膜状部件。

公开(公告)号：US06705505B2

公开(公告)日：2004-03-16

申请号：US10278917

申请日：2002-10-24

Applicant: Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

Inventor： Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

IPC: B23K306

CPC classification number: H05K3/3484 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2203/0143

Abstract: A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.

Abstract translation: 一种焊接系统，其减少了将糊料供应和焊接到印刷电路板上的步骤数量。 印刷电路板具有通孔，每个所提供的部分的引线将被插入。 打印掩模与通孔匹配，并且设置具有孔的糊状物接收板，相应于通孔向其供应焊膏。 通过强力旋转印刷辊以填充焊膏，印刷辊被跟随印刷辊，以进一步填充通孔。 零件加载在通孔上，并在印刷电路板和糊状物接收板上进行回流，从而将零件焊接到印刷电路板上。

公开(公告)号：US06203655B1

公开(公告)日：2001-03-20

申请号：US09197464

申请日：1998-11-23

Applicant: Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

Inventor： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

IPC: B32B3120

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/284 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Abstract translation: 在膜的一个表面上形成包括天线线圈的电导体图案。 电子部件通过临时固定材料固定在膜上。 覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。 与层压同时，电子部件连接到电导体图案。