Invention Grant
US5562243A Method an apparatus for obtaining reflow oven settings for soldering a
PCB
失效
方法一种用于获得焊接PCB的回流炉设置的设备
- Patent Title: Method an apparatus for obtaining reflow oven settings for soldering a PCB
- Patent Title (中): 方法一种用于获得焊接PCB的回流炉设置的设备
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Application No.: US336453Application Date: 1994-11-09
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Publication No.: US5562243APublication Date: 1996-10-08
- Inventor: Angelo R. Marcantonio
- Applicant: Angelo R. Marcantonio
- Applicant Address: NJ Princeton
- Assignee: Siemens Corporate Research, Inc.
- Current Assignee: Siemens Corporate Research, Inc.
- Current Assignee Address: NJ Princeton
- Main IPC: B23K1/008
- IPC: B23K1/008 ; G05D23/19 ; H05K3/34 ; B23K3/00
Abstract:
An artificial neural network is trained to recognize inputted thermal and physical features of a printed circuit board, for providing settings for a reflow oven for obtaining acceptable soldering of the printed circuit board.
Public/Granted literature
- US5356608A Preparation of a high purity aluminum nitride antenna window by organometallic pyrolysis Public/Granted day:1994-10-18
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