发明授权
US5601228A Solder-precipitating composition and mounting method using the
composition
失效
焊料沉淀组合物和使用该组合物的安装方法
- 专利标题： Solder-precipitating composition and mounting method using the composition
- 专利标题（中）： 焊料沉淀组合物和使用该组合物的安装方法
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申请号： US501085申请日： 1995-08-02
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公开(公告)号： US5601228A公开(公告)日： 1997-02-11
- 发明人: Takao Fukunaga , Kazuhito Higasa , Hirokazu Shiroishi , Seishi Kumamoto , Takahiro Fujiwara , Noriko Katayama
- 申请人： Takao Fukunaga , Kazuhito Higasa , Hirokazu Shiroishi , Seishi Kumamoto , Takahiro Fujiwara , Noriko Katayama
- 申请人地址： JPX Tokyo JPX Kakogawa
- 专利权人： The Furukawa Electric Co., Ltd.,Harima Chemicals, Inc.
- 当前专利权人： The Furukawa Electric Co., Ltd.,Harima Chemicals, Inc.
- 当前专利权人地址： JPX Tokyo JPX Kakogawa
- 优先权： JPX5-340024 19931206
- 主分类号： B23K35/02
- IPC分类号： B23K35/02 ; B23K35/26 ; B23K35/34 ; H05K3/34
摘要：
The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.
公开/授权文献
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