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1.发明授权
公开(公告)号：US5601228A
公开(公告)日：1997-02-11
申请号：US501085
申请日：1995-08-02
Applicant: Takao Fukunaga , Kazuhito Higasa , Hirokazu Shiroishi , Seishi Kumamoto , Takahiro Fujiwara , Noriko Katayama
Inventor： Takao Fukunaga , Kazuhito Higasa , Hirokazu Shiroishi , Seishi Kumamoto , Takahiro Fujiwara , Noriko Katayama
CPC classification number: B23K35/025 , B23K35/262 , B23K35/268 , B23K35/34 , H05K3/3484 , H05K2203/125 , Y10T29/49144
Abstract: The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.
Abstract translation: PCT No.PCT / JP94 / 02047 Sec。 371日期：1995年8月2日 102（e）日期1995年8月2日PCT 1994年12月6日PCT PCT。 出版物WO95 / 15834 日期：1995年6月15日本发明提供了含有Sn-Pb合金粉末和Pb的有机酸盐作为必要成分的焊料沉淀组合物，并且能够通过Sn-Pb合金粉末中包含的Sn的取代而使焊料沉淀 和Pb中有机酸盐中含有的Pb。 此外，本发明提供了一种安装方法，包括以下步骤：在板上提供含有Sn-Pb合金粉末和Pb的有机酸盐作为必需组分的焊料沉淀组合物，加热供给的焊料沉淀组合物 导体，通过Sn-Pb合金粉末中的Sn和Pb的有机酸盐中的Pb离子之间的取代反应，将焊料沉淀在导体上并用焊料预先涂覆导体，将装置安装在焊料上 预涂导体，并熔化焊料层，以将装置牢固地安装在导体上。
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Patent Agency Ranking
公开(公告)号：US5296649A
公开(公告)日：1994-03-22
申请号：US852526
申请日：1992-03-17
Applicant: Izumi Kosuga , Kenichi Fuse , Takao Fukunaga , Hirokazu Shiroishi , Masanao Kohno , Hisao Irie
Inventor： Izumi Kosuga , Kenichi Fuse , Takao Fukunaga , Hirokazu Shiroishi , Masanao Kohno , Hisao Irie
CPC classification number: H05K3/3484 , B23K35/0222 , B23K35/34 , H05K1/111 , H05K2201/094 , H05K2201/09918 , H05K2201/10689 , H05K2203/0435 , H05K3/3421 , H05K3/3452 , Y02P70/611
Abstract: A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.
Abstract translation: 在电路板主体上以0.5mm以下的间距形成多个焊盘。 焊盘形成为使得来自板体表面的焊盘的突出高度H和焊盘的宽度W满足关系2H
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公开(公告)号：US4958260A
公开(公告)日：1990-09-18
申请号：US311462
申请日：1989-02-15
Applicant: Kenzo Kobayashi , Hirokazu Shiroishi
Inventor： Kenzo Kobayashi , Hirokazu Shiroishi
CPC classification number: H05K1/189 , H05K1/0284 , H05K2201/042 , H05K2201/046 , H05K2201/0999 , H05K2201/10189 , H05K2201/2009 , H05K2203/1327 , H05K3/0058
Abstract: A molded circuit board is constructed by forming a plurality of resin moldings integrally with a circuit film including an insulating film and circuit pattern on the insulating film, spaced specified distances therebetween, on one side of the circuit film. The plurality of moldings can be assembled into an electronic device box by bending the intermediate portion, between the moldings, of the circuit film.
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公开(公告)号：US5268702A
公开(公告)日：1993-12-07
申请号：US858209
申请日：1992-03-26
Applicant: Toshiaki Amano , Hirokazu Shiroishi , Kenichi Fuse , Yutaka Higashiguchi , Hirotaka Kashiwabara , Mitsuo Inagaki , Hidehiro Mishiro
Inventor： Toshiaki Amano , Hirokazu Shiroishi , Kenichi Fuse , Yutaka Higashiguchi , Hirotaka Kashiwabara , Mitsuo Inagaki , Hidehiro Mishiro
CPC classification number: H01Q1/243 , H01Q9/0407
Abstract: A ground conducting layer and an antenna element conducting layer are set at a predetermined position in a cavity of a molding die, and molten resin is injected into the cavity, thereby molding a resin-formed member in which said ground conducting layer and said antenna element conducting layer are integrated. As a result of this, there can provided an antenna module comprising a resin member formed by molding to be a predetermined shape, a sheet-like ground conducting layer adhered to one surface of the resin member, a sheet-like antenna element conducting layer adhered to another surface opposing to the one surface of said resin member, and a feeder for feeding electricity to the antenna element conducting layer.
Abstract translation: 将接地导电层和天线元件导电层设置在成型模具的空腔中的预定位置，并将熔融树脂注入空腔中，从而模制树脂成形构件，其中所述接地导电层和所述天线元件 导电层集成。 作为其结果，可以提供一种天线模块，其包括通过模制成为预定形状的树脂构件，粘附到树脂构件的一个表面上的片状接地导电层，粘附到片状天线元件导电层 到与所述树脂构件的一个表面相对的另一表面，以及用于向天线元件导电层供电的馈电器。
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公开(公告)号：US5038255A
公开(公告)日：1991-08-06
申请号：US595247
申请日：1990-10-10
Applicant: Jun Nishihashi , Toshiyuki Kondo , Masato Ono , Hirokazu Shiroishi , Osamu Waki
Inventor： Jun Nishihashi , Toshiyuki Kondo , Masato Ono , Hirokazu Shiroishi , Osamu Waki
IPC: B60Q1/26 , F21S8/10 , F21V17/00 , F21V17/10 , F21V19/00 , F21V23/06 , F21V29/00 , H05B33/08 , H05K1/00 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/00 , H05K3/30 , H05K3/34
CPC classification number: F21V29/70 , B60Q1/2696 , F21S48/212 , F21S48/215 , F21S48/255 , F21V29/87 , H05B33/0803 , H05B33/0821 , H05B33/089 , H05K1/183 , H05K3/303 , F21S48/328 , F21Y2101/00 , H05K1/0203 , H05K1/0284 , H05K1/0373 , H05K1/0393 , H05K2201/0209 , H05K2201/09045 , H05K2201/09063 , H05K2201/09118 , H05K2201/10106 , H05K2201/10446 , H05K2201/10583 , H05K2201/10651 , H05K2203/167 , H05K3/0064 , H05K3/301 , H05K3/3405 , Y02P70/613 , Y10S362/80
Abstract: A vehicle lamp is mounted on vehicles such as automobiles. The lamp has an inner chamber constructed by a lamp housing and a lens, respectively having long shapes. In the chamber, there is a long light source fixing face member on which plural light sources are fixed. All light sources or electric bulbs are neatly fitted to convex or concave guide portions. Circuit patterns are printed on an inner face of the housing. Terminals of the light sources come into contact with the circuit patterns. The housing is made of particular synthetic resin having a good heat conductivity, so that no heat is accumulated in the chamber.
Abstract translation: 车辆灯安装在诸如汽车的车辆上。 该灯具有分别具有长形状的灯壳和透镜构成的内室。 在该室中存在多个光源固定的长光源固定面部件。 所有光源或电灯泡整齐地装配到凸形或凹形导向部分。 电路图案印在外壳的内表面上。 光源的端子与电路图案接触。 壳体由具有良好导热性的特定合成树脂制成，从而在室内不会积聚热量。
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公开(公告)号：US4914259A
公开(公告)日：1990-04-03
申请号：US311838
申请日：1989-02-16
Applicant: Kenzo Kobayashi , Hirokazu Shiroishi
Inventor： Kenzo Kobayashi , Hirokazu Shiroishi
CPC classification number: H05K3/0058 , H05K3/306 , H05K3/3415 , H05K1/0393 , H05K2201/096 , H05K2201/09827 , H05K2201/10575 , H05K2201/10636 , H05K2201/10863 , H05K2201/10977 , H05K2201/2036 , H05K2203/1327 , H05K2203/1572 , H05K3/28 , H05K3/3447 , Y02P70/611 , Y02P70/613
Abstract: A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.
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