发明授权
- 专利标题： Adhesive tape for electronic parts and liquid adhesive
- 专利标题（中）： 电子部件和液体胶粘剂胶带
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申请号： US636444申请日： 1996-04-23
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公开(公告)号： US5614316A公开(公告)日： 1997-03-25
- 发明人: Takeshi Hashimoto , Akira Tezuka , Takeshi Nishigaya , Fumiyoshi Yamanashi
- 申请人： Takeshi Hashimoto , Akira Tezuka , Takeshi Nishigaya , Fumiyoshi Yamanashi
- 申请人地址： JPX Tokyo
- 专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人： Tomoegawa Paper Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-164496 19950608
- 主分类号： C08C19/36
- IPC分类号： C08C19/36 ; C08F8/30 ; C08F8/42 ; C08F20/52 ; C08F220/60 ; C08F265/00 ; C08F265/08 ; C08F279/02 ; C08G73/00 ; C08G77/26 ; C08G77/28 ; C08L9/02 ; C09J7/02 ; C09J109/02 ; C09J121/00 ; C09J133/02 ; C09J133/20 ; H01L21/52 ; H01L23/40 ; B32B15/08 ; B32B7/10 ; B32B27/28
摘要：
This invention provide an adhesive tape by which adhesion to a metal spreader is not required and a cutting process is not necessary. The adhesive tape comprises an adhesive layer provided on at least one surface of metal sheet, said adhesive layer being semi-cured into a B-stage and comprised of: (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer of the formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as l, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in a range of 10 to 900 parts by weight, and said adhesive layer being composed of at least two semi-cured layers having each a different status of semi-cure.