发明授权
- 专利标题： Manufacturing flexible circuit board assemblies with common heat spreaders
- 专利标题（中）： 制造具有普通散热器的柔性电路板组件
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申请号： US476759申请日： 1995-06-07
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公开(公告)号： US5638597A公开(公告)日： 1997-06-17
- 发明人: Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
- 申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/367 ; H01L23/538 ; H05K1/00 ; H05K1/02 ; H05K1/18 ; H05K3/00 ; H05K3/12 ; H05K3/34 ; H05K7/20 ; H05K3/36
摘要：
A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.
公开/授权文献
- US4999747A Flash hair pin 公开/授权日：1991-03-12