公开(公告)号：US5638597A

公开(公告)日：1997-06-17

申请号：US476759

申请日：1995-06-07

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20 ,  H05K3/36

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.

摘要翻译： 多层柔性电路板具有多个较厚的区域，组件安装在该较厚的区域上，较薄的，更柔性的区域具有较少的布线层，板可围绕线弯曲，而不会弯曲较厚的区域。 表面安装部件如QFP和倒装芯片安装在前侧，表面安装和销孔组件安装在电路板的背面，在较厚的区域。 散热器层压到较厚区域的背面。 较厚的区域具有窗口，其中引线接合芯片安装在散热器上，并且引线键合到板的前侧。 导热粘合剂或油脂连接在后侧部件的顶部和空腔的底部之间。 散热器螺栓连接在一起和/或连接到外壳框架以改善热性能。

公开(公告)号：US5969945A

公开(公告)日：1999-10-19

申请号：US808829

申请日：1997-02-27

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.

摘要翻译： 丝网印刷夹具具有安装在一侧的部件的柔性电路板，以允许将焊膏的图案屏蔽到第二侧上，以便随后将部件附接到该侧。 在电子封装组件中，具有部件的柔性电路板围绕具有空腔的散热器组件缠绕，使得柔性电路板上的至少一个部件位于腔内并与散热器热连接。

公开(公告)号：US5831828A

公开(公告)日：1998-11-03

申请号：US71630

申请日：1993-06-03

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A multi-layer flexible circuit board has thicker regions to which surface-mount-technology (SMT) components (such as flip chips and QFPs) and pin-in-hole (PIH) components are mounted on both sides and which contains conductive through vias between wiring layers. After the SMT components have been mounted to the first side, a screening fixture with a support surface that has cavities conforming the components on the first side, is used to screen solder paste to the other side of the board. The thicker regions are surrounded by thinner regions of the board with fewer wiring layers and preferably fewer or thinner dielectric layers, and which can be bent along a line without bending the thicker regions. A common heat spreader plate with cavities or holes for multiple components is laminated to the thicker regions on one side of the board. The thicker regions have windows in which wire-bond chips are mounted to the heat spreader and the chips are wirebonded to the other side of the board. A thermally conductive adhesive or grease connects between the components and the bottoms of the cavities. Two heat sink plates are bolted together and along with other such heat sink plates are bolted to an enclosure frame to improve thermal performance.

摘要翻译： 多层柔性电路板具有较厚的区域，表面贴装技术（SMT）部件（例如倒装芯片和QFP）和销钉（PIH）部件安装在两侧并且包含导电通孔 布线层之间。 在SMT部件已经安装到第一侧之后，使用具有与第一面上的部件相符合的空腔的支撑表面的屏蔽夹具将焊膏屏蔽到板的另一侧。 较厚的区域由较薄的区域围绕，具有更少的布线层，优选更少或更薄的介电层，并且可以沿着线弯曲而不弯曲较厚的区域。 具有用于多个部件的空腔或孔的普通散热板被层压到板的一侧上较厚的区域。 较厚的区域具有将引线键合芯片安装到散热器的窗口，并且芯片被引线键合到板的另一侧。 导热粘合剂或油脂在部件和空腔的底部之间连接。 两个散热板被螺栓连接在一起，并且与其它这样的散热板一起用螺栓连接到外壳框架以改善热性能。

公开(公告)号：US5759269A

公开(公告)日：1998-06-02

申请号：US470507

申请日：1995-06-06

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20 ,  B05C13/00

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A screen printing machine comprising a backing plate with holes conforming to components attached to the surface of a flexible circuit board. The machine includes a screen which patterns solder paste on the surface of the circuit board while the circuit board is on the backing plate. Also included is a spring loaded element disposed adjacent to the backing plate which applies a predetermined continuous force to the four corners of the circuit board. This force is applied in a diagonal direction to the corners to stretch the circuit board so that the circuit board is parallel to the backing plate during screening.

摘要翻译： 一种丝网印刷机，其包括具有与附接到柔性电路板的表面的部件相符的孔的背板。 该机器包括在电路板位于背板上时在电路板表面上形成焊膏的屏幕。 还包括弹簧加载元件，其布置成与背板相邻，其向电路板的四个角施加预定的连续力。 该力沿对角方向施加到角部以拉伸电路板，使得电路板在屏蔽期间平行于背板。

公开(公告)号：US4803100A

公开(公告)日：1989-02-07

申请号：US110892

申请日：1987-10-21

申请人： Joseph G. Ameen ,  Timothy F. Carden ,  Lawrence R. Cutting ,  Stephen R. Engle ,  Ronald J. Moore

发明人： Joseph G. Ameen ,  Timothy F. Carden ,  Lawrence R. Cutting ,  Stephen R. Engle ,  Ronald J. Moore

IPC分类号： C09K5/00 ,  C09K5/08 ,  H01L23/36 ,  B05D3/02 ,  H01B3/20

CPC分类号： C09K5/08 ,  H01L2224/73253

摘要： A suspension of a coating material having hydrogen bonds and pre-determined physical and chemical characteristics in a predominantly solid state in a polar solvent that is capable of breaking the hydrogen bonds and providing the material in a liquid form and use of the suspension to provide substantially uniform conformal layer of material onto a workpiece by applying the suspension to a workpiece and then evaporating the polar organic solvent so that the coating material is provided in its predominantly solid state having substantially the predetermined physicall and chemical characteristics.