发明授权
- 专利标题： Method for forming three dimensional processor using transferred thin film circuits
- 专利标题（中）： 使用转移薄膜电路形成三维处理器的方法
-
申请号： US531177申请日： 1995-09-19
-
公开(公告)号： US5656548A公开(公告)日： 1997-08-12
- 发明人: Paul M. Zavracky , Matthew Zavracky , Duy-Phach Vu , Brenda Dingle
- 申请人： Paul M. Zavracky , Matthew Zavracky , Duy-Phach Vu , Brenda Dingle
- 申请人地址： MA Taunton
- 专利权人： Kopin Corporation
- 当前专利权人： Kopin Corporation
- 当前专利权人地址： MA Taunton
- 主分类号： H01L21/822
- IPC分类号： H01L21/822 ; H01L21/98 ; H01L23/498 ; H01L25/065 ; H01L25/18 ; H01L27/00 ; H01L27/04 ; H01L27/10 ; H01L21/18
摘要：
A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
公开/授权文献
信息查询
IPC分类:
