发明授权
- 专利标题： Method of fabricating compliant interface for semiconductor chip
- 专利标题（中）： 制造半导体芯片兼容接口的方法
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申请号： US365699申请日： 1994-12-29
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公开(公告)号： US5659952A公开(公告)日： 1997-08-26
- 发明人: Zlata Kovac , Craig Mitchell , Thomas H. Distefano , John W. Smith
- 申请人： Zlata Kovac , Craig Mitchell , Thomas H. Distefano , John W. Smith
- 申请人地址： CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： CA San Jose
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/56 ; H01L21/60 ; H01L23/28 ; H01L23/48 ; H01L23/498 ; H05K1/11 ; H05K3/36 ; H05K3/40 ; H05K3/34
摘要：
A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.
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