Invention Grant
- Patent Title: Low temperature lead-free solder compositions
- Patent Title (中): 低温无铅焊料组成
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Application No.: US753575Application Date: 1996-11-26
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Publication No.: US5755896APublication Date: 1998-05-26
- Inventor: Mohan R. Paruchuri , Dongkai Shangguan
- Applicant: Mohan R. Paruchuri , Dongkai Shangguan
- Applicant Address: MI Dearborn
- Assignee: Ford Motor Company
- Current Assignee: Ford Motor Company
- Current Assignee Address: MI Dearborn
- Main IPC: B23K35/26
- IPC: B23K35/26 ; C22C12/00 ; C22C13/02 ; C22C30/04 ; C22C7/00
Abstract:
Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.
Public/Granted literature
- US5186633A Surface mount electrical connector with interleaved solder tails Public/Granted day:1993-02-16
Information query
IPC分类:
