公开(公告)号：US08092102B2

公开(公告)日：2012-01-10

申请号：US11444277

申请日：2006-05-31

申请人： Dongkai Shangguan ,  Samuel Waising Tam

发明人： Dongkai Shangguan ,  Samuel Waising Tam

IPC分类号： G03B17/00

CPC分类号： G03B17/02 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49175 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00014

摘要： A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.

摘要翻译： 一种新颖的数字照相机模块包括图像捕获装置，电路基板，透镜单元和在图像捕获装置安装到电路基板之前安装到电路基板的壳体。 在一个具体实施例中，壳体通过模制形成在电路基板上。 壳体包括用于接收透镜单元的孔，孔的直径大于图像捕获装置的对角线，使得图像捕获装置可以通过孔安装到电路基板。 在另一特定实施例中，电路基板包括孔，以便于图像捕获装置的倒装芯片接合。 图像捕获装置和壳体耦合到电路基板的顺序有助于防止在将壳体安装到电路基板期间损坏图像捕获装置。

公开(公告)号：US06082610A

公开(公告)日：2000-07-04

申请号：US880955

申请日：1997-06-23

申请人： Dongkai Shangguan ,  Mohan Paruchuri ,  Achyuta Achari

发明人： Dongkai Shangguan ,  Mohan Paruchuri ,  Achyuta Achari

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/34 ,  B23K1/20 ,  H01L21/441 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/81 ,  H05K3/3463 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/30107 ,  Y10T29/49144

摘要： A method which utilizes flip chip technology to provide interconnection between printed circuit boards and integrated circuits is disclosed. The method involves metallization of the bond pad and multiple, novel bump compositions and coating compositions to provide an interconnection which is reliable and which withstands differences in the coefficient of thermal expansion between the silicon device and the bump material.

摘要翻译： 公开了一种利用倒装芯片技术提供印刷电路板和集成电路之间的互连的方法。 该方法涉及金属化接合焊盘和多个新颖的凸块组合物和涂层组合物，以提供可靠的互连，并且能够承受硅器件和凸块材料之间的热膨胀系数的差异。

公开(公告)号：US5755896A

公开(公告)日：1998-05-26

申请号：US753575

申请日：1996-11-26

申请人： Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/26 ,  C22C12/00 ,  C22C13/02 ,  C22C30/04 ,  C22C7/00

CPC分类号： B23K35/262 ,  B23K35/264 ,  C22C12/00 ,  C22C13/02 ,  C22C30/04

摘要： Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.

摘要翻译： 包含37-53％锡，37-57％铋和6-10％铟的熔融组合物（重量百分数）（1），熔融温度在99-124℃之间，和（2）包含 48-58％锡，40-50％铋和2-5％铟，熔融温度在125-157℃之间。

公开(公告)号：US5429689A

公开(公告)日：1995-07-04

申请号：US299230

申请日：1994-08-31

申请人： Dongkai Shangguan ,  Achyuta Achari

发明人： Dongkai Shangguan ,  Achyuta Achari

IPC分类号： B23K35/26 ,  C22C13/02

CPC分类号： C22C13/02 ,  B23K35/262

摘要： A non-toxic alloy for soldering electronic components comprising 80% Sn, 5-14.5% In, 4.5-14.5% Bi and 0.5% Ag. The disclosed alloy has a fine microstructure. Particles of intermetallic compounds are finely dispersed throughout the matrix, thereby inhibiting grain growth. Accordingly, the alloy does not significantly coarsen after thermal aging.

摘要翻译： 用于焊接电子元件的无毒合金，包括80％Sn，5-14.5％In，4.5-14.5％Bi和0.5％Ag。 所公开的合金具有精细的微观结构。 金属间化合物的颗粒细分散在整个基质中，从而抑制晶粒生长。 因此，在热老化后，合金不会显着变粗糙。

公开(公告)号：US08477239B2

公开(公告)日：2013-07-02

申请号：US12930822

申请日：2011-01-18

申请人： Vidyadhar Sitaram Kale ,  Samuel Waising Tam ,  Dongkai Shangguan

发明人： Vidyadhar Sitaram Kale ,  Samuel Waising Tam ,  Dongkai Shangguan

IPC分类号： H04N5/225 ,  H01L23/02 ,  H01L21/00

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

摘要翻译： 一种用于在非常小的数码相机，蜂窝电话，个人数字助理等中捕获视频图像的集成照相机模块（10,10a）。 透镜组件（24,24a）通过模制件（26）相对于相机芯片（12）的传感器阵列区域（14）刚性地固定。 模制件（26）形成在相机芯片（12）上，并且可选地形成在其上安装相机芯片（12）的印刷电路板（16,16a）上。 透镜组件（24,24a）通过粘合剂（28）保持在模制件（26）的凹部（29）中。 模制件（26）形成为使得在透镜组件（24）和相机芯片（12）的传感器阵列区域（14）之间存在精确的间隙（30）。

公开(公告)号：US07796187B2

公开(公告)日：2010-09-14

申请号：US11247993

申请日：2005-10-11

申请人： Dongkai Shangguan ,  Vidyadhar Sitaram Kale ,  Samuel Waising Tam

发明人： Dongkai Shangguan ,  Vidyadhar Sitaram Kale ,  Samuel Waising Tam

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： An integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12). In a particular embodiment, lens holders (306, 506) are formed entirely on the camera chips (302, 502) before or after they are separated from one another.

摘要翻译： 一种用于在非常小的数码相机，蜂窝电话，个人数字助理等中捕获视频图像的集成相机模块（10,10a）。 透镜组件（24,24a）通过模制件（26）相对于相机芯片（12）的传感器阵列区域（14）刚性地固定。 模制件（26）形成在相机芯片（12）上，并且可选地形成在其上安装相机芯片（12）的印刷电路板（16,16a）上。 透镜组件（24,24a）通过粘合剂（28）保持在模制件（26）的凹部（29）中。 模制件（26）形成为使得在透镜组件（24）和相机芯片（12）的传感器阵列区域（14）之间存在精确的间隙（30）。 在特定实施例中，透镜保持器（306,506）在它们彼此分离之前或之后完全形成在相机芯片（302,502）上。

公开(公告)号：US20070236591A1

公开(公告)日：2007-10-11

申请号：US11402196

申请日：2006-04-11

申请人： Samuel Tam ,  Dongkai Shangguan

发明人： Samuel Tam ,  Dongkai Shangguan

IPC分类号： H04N5/335 ,  H01S4/00

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2924/00

摘要： A method for manufacturing camera modules including image capture devices with protective covers is disclosed. The method includes providing a unitary transparent substrate including a plurality of individual protective covers, providing a unitary component substrate including a plurality of individual component parts, bonding the unitary transparent substrate to the unitary component substrate, dividing the transparent substrate into a plurality of discrete protective covers, and separating the component parts from one another. According to one particular method, the component substrate is a semiconductor wafer having a plurality of integrated electronic image capture devices formed therein. According to another particular method, the component substrate is a circuit board having a plurality of individual device circuit boards formed therein.

摘要翻译： 公开了一种用于制造包括具有保护盖的图像捕获装置的相机模块的方法。 该方法包括提供包括多个单独保护盖的单一透明基板，提供包括多个单独部件的单一部件基板，将单一透明基板结合到单一部件基板上，将透明基板分割为多个离散保护 覆盖并将部件彼此分开。 根据一种特定方法，组件衬底是其中形成有多个集成电子图像捕获器件的半导体晶片。 根据另一特定方法，组件衬底是其中形成有多个单独的器件电路板的电路板。

公开(公告)号：US20060132644A1

公开(公告)日：2006-06-22

申请号：US11247993

申请日：2005-10-11

申请人： Dongkai Shangguan ,  Vidyadhar Kale ,  Samuel Tam

发明人： Dongkai Shangguan ,  Vidyadhar Kale ,  Samuel Tam

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00014

摘要： An integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12). In a particular embodiment, lens holders (306, 506) are formed entirely on the camera chips (302, 502) before or after they are separated from one another.

摘要翻译： 一种用于在非常小的数码相机，蜂窝电话，个人数字助理等中捕获视频图像的集成摄像机模块（10,10a）。 透镜组件（24,24a）通过模制件（26）相对于相机芯片（12）的传感器阵列区域（14）刚性地固定。 模制件（26）形成在相机芯片（12）上，并且可选地形成在其上安装相机芯片（12）的印刷电路板（16,16a）上。 透镜组件（24,24a）通过粘合剂（28）保持在模制件（26）的凹部（29）中的适当位置。 模制件（26）形成为使得在透镜组件（24）和相机芯片（12）的传感器阵列区域（14）之间存在精确的间隙（30）。 在特定实施例中，透镜保持器（306,506）在它们彼此分离之前或之后完全形成在相机芯片（302,502）上。

公开(公告)号：US20050185088A1

公开(公告)日：2005-08-25

申请号：US10784102

申请日：2004-02-20

申请人： Vidyadhar Kale ,  Samuel Tam ,  Dongkai Shangguan

发明人： Vidyadhar Kale ,  Samuel Tam ,  Dongkai Shangguan

IPC分类号： H01L27/146 ,  H01L31/0232 ,  H04N5/225

CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

摘要翻译： 一种用于在非常小的数码相机，蜂窝电话，个人数字助理等中捕获视频图像的集成照相机模块（10,10a）。 透镜组件（24,24a）通过模制件（26）相对于相机芯片（12）的传感器阵列区域（14）刚性地固定。 模制件（26）形成在相机芯片（12）上，并且可选地形成在其上安装相机芯片（12）的印刷电路板（16,16a）上。 透镜组件（24,24a）通过粘合剂（28）保持在模制件（26）的凹部（29）中的适当位置。 模制件（26）形成为使得在透镜组件（24）和相机芯片（12）的传感器阵列区域（14）之间存在精确的间隙（30）。

公开(公告)号：US5871690A

公开(公告)日：1999-02-16

申请号：US939644

申请日：1997-09-29

申请人： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/26 ,  C22C13/02

CPC分类号： B23K35/268 ,  B23K35/262

摘要： Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154.degree.-162.degree. C. The solder compositions have microstructure similarly to Sn/Pb eutectic microstructure which makes them have excellent properties like higher yield strength and better creep resistance providing long term reliability to solder joints.

摘要翻译： 具有45-60％Sn之间的低温电焊料组成（重量百分比） 25-40％Pb; 5-15％Bi; 和0.5-2.5％。 优选地，焊料组合物的熔融温度为约154°-162℃。焊料组合物具有类似于Sn / Pb共晶组织的微结构，这使得它们具有优异的性能，例如更高的屈服强度和更好的抗蠕变性，为焊料提供长期的可靠性 关节。