公开(公告)号：US5755896A

公开(公告)日：1998-05-26

申请号：US753575

申请日：1996-11-26

申请人： Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/26 ,  C22C12/00 ,  C22C13/02 ,  C22C30/04 ,  C22C7/00

CPC分类号： B23K35/262 ,  B23K35/264 ,  C22C12/00 ,  C22C13/02 ,  C22C30/04

摘要： Solder compositions (by weight percent) (1) comprising between 37-53% tin, 37-57% bismuth, and 6-10% indium and having a melting temperature between 99.degree.-124.degree. C., and (2) comprising between 48-58% tin, 40-50% bismuth, and 2-5% indium and having a melting temperature between 125-157.

摘要翻译： 包含37-53％锡，37-57％铋和6-10％铟的熔融组合物（重量百分数）（1），熔融温度在99-124℃之间，和（2）包含 48-58％锡，40-50％铋和2-5％铟，熔融温度在125-157℃之间。

公开(公告)号：US06360939B1

公开(公告)日：2002-03-26

申请号：US09414207

申请日：1998-10-07

申请人： Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K3102

CPC分类号： H05K3/3484 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0272

摘要： A method of manufacturing a lead-free electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 80-99% Sn and 1-20% Ag. The additive powder metal is selected from the metal group comprising Sn, Ni, Cu, Ag, and Bi and mixtures thereof.

摘要翻译： 一种制造无铅电焊膏的方法，其具有在焊接过程中不熔化的主要焊料粉末和添加金属粉末成分。 金属粉末可以是元素金属或金属合金。 初级粉末与常规焊膏中使用的粉末相同。 添加剂粉末的熔点显着高于初级粉末的熔点。 初级粉末包含80-99％的Sn和1-20％的Ag。 添加剂粉末金属选自Sn，Ni，Cu，Ag和Bi及其混合物。

公开(公告)号：US5871690A

公开(公告)日：1999-02-16

申请号：US939644

申请日：1997-09-29

申请人： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/26 ,  C22C13/02

CPC分类号： B23K35/268 ,  B23K35/262

摘要： Low temperature electrical solder compositions (by weight percent) having between 45-60% Sn; 25-40% Pb; 5-15% Bi; and 0.5-2.5% In. Preferably, the solder compositions have a melting temperature of about 154.degree.-162.degree. C. The solder compositions have microstructure similarly to Sn/Pb eutectic microstructure which makes them have excellent properties like higher yield strength and better creep resistance providing long term reliability to solder joints.

摘要翻译： 具有45-60％Sn之间的低温电焊料组成（重量百分比） 25-40％Pb; 5-15％Bi; 和0.5-2.5％。 优选地，焊料组合物的熔融温度为约154°-162℃。焊料组合物具有类似于Sn / Pb共晶组织的微结构，这使得它们具有优异的性能，例如更高的屈服强度和更好的抗蠕变性，为焊料提供长期的可靠性 关节。

公开(公告)号：US5863493A

公开(公告)日：1999-01-26

申请号：US771351

申请日：1996-12-16

申请人： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Achyuta Achari ,  Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/26 ,  C22C13/00 ,  H05K3/34

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K2201/36

摘要： Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220.degree. C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn--Ni, Sn--Cu and Sn--Cu--Ni intermetallic phases that provide resistance to grain growth during thermal cycling.

摘要翻译： 锡焊料组成（重量百分比）为91.5-96.5％Sn; 2-5％Ag; 0.1-3％Ni; 和0-2.9％Cu; 熔点220℃以下。 焊料组合物具有均匀分散的Sn-Ni，Sn-Cu和Sn-Cu-Ni金属间相的微细颗粒的微观结构，其在热循环期间提供对晶粒生长的抵抗力。

公开(公告)号：US6027575A

公开(公告)日：2000-02-22

申请号：US958235

申请日：1997-10-27

申请人： Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/26 ,  H05K3/34

CPC分类号： H05K3/3463 ,  B23K35/26

摘要： The invention is a self-low-temperature curing metallic adhesive with thermal and electrical conductivity. It comprises a paste mixture of a liquid metal having a melting temperature below 30.degree. C. and comprising: (1) 99.2-75 wt. % gallium and (2) aluminum or zinc and (3) optionally tin or indium; and a metallic powder selected from the group consisting of: zirconium, rare earth elements, copper, nickel, silver, antimony, cobalt, chromium, germanium, gold, iron, magnesium, manganese, platinum, palladium, and vanadium, and combinations of any of them.

摘要翻译： 本发明是具有导热性和导电性的自低温固化金属粘合剂。 它包括熔融温度低于30℃的液态金属的糊料混合物，其包含：（1）99.2-75wt。 ％镓和（2）铝或锌和（3）任选的锡或铟; 和选自锆，稀土元素，铜，镍，银，锑，钴，铬，锗，金，铁，镁，锰，铂，钯和钒的金属粉末，以及任何 的他们。

公开(公告)号：US5833921A

公开(公告)日：1998-11-10

申请号：US938574

申请日：1997-09-26

申请人： Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/26 ,  C22C30/04

CPC分类号： B23K35/264 ,  C22C30/04

摘要： Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133.degree.-167.degree. C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.

摘要翻译： 电焊料组合物（重量百分比）具有43-58％的Sn; 38-52％Bi; 和至少一种：5-15％的Sb; 1-4.0％Cu; 2％ 和1-2％Ag，熔融温度为133°-167℃。焊料是无铅的并且具有低熔点，使得它们特别适用于其中待连接的组分涉及热塑性基材的应用。

公开(公告)号：US5928404A

公开(公告)日：1999-07-27

申请号：US827589

申请日：1997-03-28

申请人： Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H05K3/34 ,  C22C13/00

CPC分类号： H05K3/3484 ,  B23K35/025 ,  B23K35/262 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K3/3442 ,  H05K3/3463

摘要： A method of manufacturing an electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 60-99% Sn, 0-40% Pb and 0-10% Ag. The additive powder metal is selected from the metal group comprising Sn, Pb, Ni, Cu, Ag, and Bi and mixtures thereof.

摘要翻译： 一种制造具有主焊料粉末和在焊接过程中不熔化的添加金属粉末成分的电焊膏的方法。 金属粉末可以是元素金属或金属合金。 初级粉末与常规焊膏中使用的粉末相同。 添加剂粉末的熔点显着高于初级粉末的熔点。 主要粉末包含60-99％的Sn，0-40％的Pb和0-10％的Ag。 添加剂粉末金属选自包括Sn，Pb，Ni，Cu，Ag和Bi的金属和它们的混合物。

公开(公告)号：US5894054A

公开(公告)日：1999-04-13

申请号：US781569

申请日：1997-01-09

申请人： Mohan R. Paruchuri ,  Dongkai Shangguan

发明人： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC分类号： B23K1/012 ,  B23K35/28 ,  B32B15/01 ,  F28F3/02 ,  F28F21/08 ,  B32B15/20

CPC分类号： F28F21/089 ,  B23K1/012 ,  B23K35/282 ,  B32B15/017 ,  F28F21/084 ,  F28F3/025 ,  B23K2203/10 ,  Y10S165/905 ,  Y10T428/12681 ,  Y10T428/12736 ,  Y10T428/12792

摘要： The present invention is an aluminum assembly comprising at least two components brazed to each other. The assembly comprises: at least a first aluminum based component having a coating of a zinc-antimony alloy having at least 1.0 wt. % antimony applied to a region of a surface of the component which is to be joined to a second aluminum based component; and at least one second aluminum based component disposed adjacent to the coating; whereby the at least first aluminum based component and the at least second aluminum based component are joined together during a controlled atmosphere brazing (CAB) process.

摘要翻译： 本发明是一种铝组件，其包括彼此钎焊的至少两个组件。 组件包括：至少第一铝基组分，其具有至少1.0重量％的锌 - 锑合金涂层。 施加到待连接到第二铝基部件的部件的表面的区域上的％锑; 以及至少一个第二铝基部件，其邻近所述涂层设置; 由此在受控气氛钎焊（CAB）工艺期间，将至少第一铝基组分和至少第二铝基组分接合在一起。

公开(公告)号：US07111883B1

公开(公告)日：2006-09-26

申请号：US11352155

申请日：2006-02-10

申请人： Udit Patel ,  Sunil Palakodati ,  Mohan R. Paruchuri ,  Balaji Bharadwaj ,  Abha Tiwari

发明人： Udit Patel ,  Sunil Palakodati ,  Mohan R. Paruchuri ,  Balaji Bharadwaj ,  Abha Tiwari

IPC分类号： B60R7/04

CPC分类号： B60R11/00 ,  B60R7/04 ,  B60R11/02 ,  B60R2011/0007 ,  B60R2011/0085

摘要： A center console for a motor vehicle comprising a stationary housing mounted within the vehicle. The housing includes an open center defined between opposing ends and has a console body mounted within the open center of the housing. The console body is rotatable about a longitudinal axis running through the console body and is mounted such that an operator may remove the body from the frame. Also, at least two longitudinal side walls of the rotating body are visible within the open center and the console body may be rotated such that alternate side walls may be positioned in an uppermost position with respect to the center console. Thus, a user may exchange the console body for another and access multiple sides of the console body, regardless of which is in the uppermost position.

摘要翻译： 一种用于机动车辆的中控台，其包括安装在车辆内的固定壳体。 壳体包括限定在相对端之间的开放中心，并且具有安装在壳体的开放中心内的控制台主体。 控制台主体可以围绕运行通过控制台主体的纵向轴线旋转，并且被安装成使得操作者可以将该主体从框架上移除。 此外，旋转体的至少两个纵向侧壁在打开中心内是可见的，并且控制台主体可以旋转，使得交替的侧壁可以相对于中心控制台定位在最高位置。 因此，用户可以将控制台主体更换为另一个并且访问控制台主体的多个侧面，而不管哪个处于最高位置。

公开(公告)号：US06274407B1

公开(公告)日：2001-08-14

申请号：US09619546

申请日：2000-07-19

申请人： Jay DeAvis Baker ,  Mohan R. Paruchuri ,  Prathap Amerwai Reddy ,  Vivek Amir Jairazbhoy

发明人： Jay DeAvis Baker ,  Mohan R. Paruchuri ,  Prathap Amerwai Reddy ,  Vivek Amir Jairazbhoy

IPC分类号： H01L2144

CPC分类号： H01L24/83 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01048 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method and article for attaching an electronic component, such as a semiconductor die, to a substrate includes applying a relatively low-melting-temperature solder preform to the substrate; and applying a bead of a curable bonding material to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension. After placing the die atop the solder preform so as to at least partially overlie the bonding material, the method includes heating the solder preform and the bonding material so as to reflow the solder, whereupon the solder preform collapses to allow the bonding material to engage the underside of the die, and to subsequently cure the bonding material.

摘要翻译： 用于将诸如半导体管芯的电子部件附接到基板的方法和制品包括将相对低熔点的焊料预制件施加到基板上; 以及在足以基本上容纳焊料材料的量的基础上将可固化粘合材料的珠粒施加到围绕焊料预制件周围的基底上，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和衬底之间的间隙 尺寸。 在将模具放置在焊料预制件顶部以至少部分地覆盖接合材料之后，该方法包括加热焊料预成型件和接合材料以便回流焊料，于是焊料预制件塌陷以允许接合材料接合 并且随后固化粘结材料。