- 专利标题： Thermally enhanced ball grid array package
-
申请号： US740888申请日： 1996-11-04
-
公开(公告)号： US5768774A公开(公告)日： 1998-06-23
- 发明人: James Warren Wilson , Stephen Robert Engle , Scott Preston Moore
- 申请人： James Warren Wilson , Stephen Robert Engle , Scott Preston Moore
- 申请人地址： NY Armonk
- 专利权人： International Business Machines
- 当前专利权人： International Business Machines
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/12 ; H01L23/13 ; H01L23/36 ; H01L23/367 ; H01L23/373 ; H01L23/498 ; H05K3/34
摘要：
A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.
公开/授权文献
- US5142452A Chip-type solid electrolytic capacitors 公开/授权日：1992-08-25
信息查询
IPC分类:
