- 专利标题： Three dimensional processor using transferred thin film circuits
-
申请号： US315027申请日： 1994-09-29
-
公开(公告)号： US5793115A公开(公告)日： 1998-08-11
- 发明人: Paul M. Zavracky , Matthew Zavracky , Duy-Phach Vu , Brenda Dingle
- 申请人： Paul M. Zavracky , Matthew Zavracky , Duy-Phach Vu , Brenda Dingle
- 申请人地址： MA Taunton
- 专利权人： Kopin Corporation
- 当前专利权人： Kopin Corporation
- 当前专利权人地址： MA Taunton
- 主分类号： H01L21/822
- IPC分类号： H01L21/822 ; H01L21/98 ; H01L23/498 ; H01L25/065 ; H01L25/18 ; H01L27/00 ; H01L27/04 ; H01L27/10 ; H01L23/48 ; H01L21/18 ; H01L23/52
摘要：
A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.
公开/授权文献
- USD325970S Bone planer 公开/授权日：1992-05-05
信息查询
IPC分类:
