Invention Grant
- Patent Title: Method of fabricating an electronic circuit device
- Patent Title (中): 制造电子电路装置的方法
-
Application No.: US761430Application Date: 1996-12-06
-
Publication No.: US5865365APublication Date: 1999-02-02
- Inventor: Toru Nishikawa , Ryohei Satoh , Masahide Hara , Tetsuya Hayashida , Mitugu Shirai , Osamu Yamada , Hiroko Takehara , Yasuhiro Iwata , Mitsunori Tamura , Masahito Ijuin
- Applicant: Toru Nishikawa , Ryohei Satoh , Masahide Hara , Tetsuya Hayashida , Mitugu Shirai , Osamu Yamada , Hiroko Takehara , Yasuhiro Iwata , Mitsunori Tamura , Masahito Ijuin
- Applicant Address: JPX Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JPX Tokyo
- Main IPC: B23K1/00
- IPC: B23K1/00 ; H01L21/48 ; H01L21/56 ; H01L21/60 ; H01L21/68 ; H01L23/498 ; H05K3/34
Abstract:
A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.
Public/Granted literature
- US5158153A Box lubricator reservoir and reduction drive mechanism Public/Granted day:1992-10-27
Information query
IPC分类:
