-
公开(公告)号：US06410881B1
公开(公告)日：2002-06-25
申请号：US09882019
申请日：2001-06-18
Applicant: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
Inventor： Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
IPC: B23K2600
Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
-
公开(公告)号：US06269998B1
公开(公告)日：2001-08-07
申请号：US09704784
申请日：2000-11-03
Applicant: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
Inventor： Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
IPC: B23K3102
CPC classification number: H01L24/75 , H01L24/81 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81022 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , H05K3/3489 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174 , H01L2924/00
Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
Abstract translation: 电子电路的制造方法包括将电子器件设置在电路基板上，对形成在电子器件或电路基板上的焊料进行热熔融，使电子器件和电路基板接合。 该方法包括以下步骤：将液体供给到电路基板上的焊盘上，将电子设备对准和安装在焊盘上，将电路基板放置在处理容器中并加热电路基板。 加热步骤包括控制处理容器中的气氛的压力，热熔焊料以防止液体的至少一部分蒸发直到电子器件和电路基板接合，并允许液体在 电子器件和电路基板结合。
-
公开(公告)号：US6161748A
公开(公告)日：2000-12-19
申请号：US538515
申请日：2000-03-30
Applicant: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
Inventor： Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
CPC classification number: H01L24/75 , H01L24/81 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81022 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , H05K3/3489 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174 , H01L2924/00
Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
-
Patent Agency Ranking
公开(公告)号：US06133135A
公开(公告)日：2000-10-17
申请号：US322998
申请日：1999-06-01
Applicant: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
Inventor： Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
CPC classification number: H01L24/75 , H01L24/81 , H05K3/3489 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174
Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
-
公开(公告)号：US5844311A
公开(公告)日：1998-12-01
申请号：US972034
申请日：1997-11-17
Applicant: Hideki Watanabe , Kenichi Kasai , Tositada Netsu , Hiroyuki Hidaka , Osamu Yamada , Mitsunori Tamura
Inventor： Hideki Watanabe , Kenichi Kasai , Tositada Netsu , Hiroyuki Hidaka , Osamu Yamada , Mitsunori Tamura
IPC: H01L23/36 , H01L23/433 , H01L23/473 , H01L23/34
CPC classification number: H01L23/433 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/15312
Abstract: There is disclosed a multichip module having a sealing-cooling structure which achieves a high packaging density, high sealing-connection reliability, a low manufacturing cost and a high cooling ability. A frame 15, conforming in thermal expansion coefficient to a substrate 11, is soldered at one surface thereof to that surface of the substrate 11 on which semiconductor devices 12 are mounted. The frame 15 is fastened or fixedly secured at the other surface thereof to a lid member 17 by bolts 10 or means without any heat treatment of the whole of the module.
Abstract translation: 公开了一种具有密封冷却结构的多芯片组件，其具有高封装密度，高密封连接可靠性，低制造成本和高冷却能力。 在基板11的一个表面上焊接符合热膨胀系数的基板11的框架15，在其上安装有半导体器件12的基板11的表面上。 框架15通过螺栓10或装置固定或固定在其另一表面到盖构件17，而不对整个模块进行任何热处理。
-
公开(公告)号：US5865365A
公开(公告)日：1999-02-02
申请号：US761430
申请日：1996-12-06
Applicant: Toru Nishikawa , Ryohei Satoh , Masahide Hara , Tetsuya Hayashida , Mitugu Shirai , Osamu Yamada , Hiroko Takehara , Yasuhiro Iwata , Mitsunori Tamura , Masahito Ijuin
Inventor： Toru Nishikawa , Ryohei Satoh , Masahide Hara , Tetsuya Hayashida , Mitugu Shirai , Osamu Yamada , Hiroko Takehara , Yasuhiro Iwata , Mitsunori Tamura , Masahito Ijuin
CPC classification number: H01L24/12 , B23K1/0016 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/11 , H01L24/29 , H01L24/81 , H01L24/83 , H05K3/3489 , B23K2201/40 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83805 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H05K2203/0278 , H05K2203/041 , H05K2203/0435 , H05K2203/086 , H05K2203/087 , H05K2203/095 , H05K2203/1157 , H05K3/3426
Abstract: A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.
Abstract translation: 用于制造电子电路器件的焊接方法使用供应至待接合的至少一个连接部件的有机材料。 连接构件位于氧化气氛中，并在非氧化气氛中加热以除去存在于预制部分或金属化粘合部分的表面上的氧化物和/或污染层。 通过该方法，进行无焊剂焊接，位移偏移降低，并且获得了在回流之后具有减少残留物的焊接连接的高可靠性。
-
公开(公告)号：US5940728A
公开(公告)日：1999-08-17
申请号：US647672
申请日：1996-05-15
Applicant: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
Inventor： Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
CPC classification number: H01L24/75 , H01L24/81 , H05K3/3489 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174
Abstract: A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.
Abstract translation: 一种用于制造电子电路的方法，根据该方法，可以通过施加允许在金属表面上的氧化物膜，有机物质，碳等的金属表面处理方法而不使用复合物来进行焊接，而不使用焊剂 过程也不利于影响电子设备或电路基板。 通过焊料连接电子设备和电路基板的过程包括以下步骤：用激光束照射焊料以清洁焊料，将电子器件对准和安装在电路基板上，并将所述焊料热熔化成 低氧含量的气氛来粘合电子器件和电路基板。
-
公开(公告)号：US5551148A
公开(公告)日：1996-09-03
申请号：US330569
申请日：1994-10-28
Applicant: Shinichi Kazui , Makoto Matsuoka , Hideyuki Fukasawa , Mitsunori Tamura , Mitsugu Shirai , Hideaki Sasaki
Inventor： Shinichi Kazui , Makoto Matsuoka , Hideyuki Fukasawa , Mitsunori Tamura , Mitsugu Shirai , Hideaki Sasaki
CPC classification number: H05K3/3478 , H01L21/4853 , H01L2224/11003 , H01L2224/11334 , H01L2924/01068 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/0769 , Y10T29/49149 , Y10T29/4981
Abstract: A flexible film-like member having conductive metals filled in tapered holes extending through the thickness is positioned such that the holes of the member face to respective pad patterns on a circuit board on which bumps are to be formed, the conductive metals are then heated and fused so that they are joined and transferred to the pad patterns on the circuit board, and the film-like member is then removed by heating or cleaning liquid.
Abstract translation: 具有填充在贯穿厚度的锥形孔中的导电金属的柔性膜状构件被定位成使得构件的孔面对要在其上形成凸块的电路板上的相应焊盘图案，然后导电金属被加热，并且 熔融，使其接合并转移到电路板上的焊盘图案，然后通过加热或清洗液体除去膜状部件。
-
-
-
-
-
-
-
Search Results
8
records
(took 0.016 seconds)
