公开(公告)号：US5865365A

公开(公告)日：1999-02-02

申请号：US761430

申请日：1996-12-06

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

IPC: B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426

Abstract: A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.

Abstract translation: 用于制造电子电路器件的焊接方法使用供应至待接合的至少一个连接部件的有机材料。 连接构件位于氧化气氛中，并在非氧化气氛中加热以除去存在于预制部分或金属化粘合部分的表面上的氧化物和/或污染层。 通过该方法，进行无焊剂焊接，位移偏移降低，并且获得了在回流之后具有减少残留物的焊接连接的高可靠性。

公开(公告)号：US4906823A

公开(公告)日：1990-03-06

申请号：US202027

申请日：1988-06-03

Applicant: Tadao Kushima ,  Tasao Soga ,  Kazuji Yamada ,  Mitugu Shirai

Inventor： Tadao Kushima ,  Tasao Soga ,  Kazuji Yamada ,  Mitugu Shirai

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/49827 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/19042 ,  H05K2201/09827 ,  H05K2201/10734 ,  H05K2201/2081 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/043 ,  Y10T29/49218

Abstract: The invention relates to a solder carrier comprising a sheet of self-support type, made of a material which does not react to a solder when it is melted, a plurality of small through holes, and solder filling the through holes, each of the small through holes having an end, the area of which is larger than that of the other end. By using this solder carrier, a semiconductor device can be flip-chip-connected to a carrier substrate through a bump method, and solder balls can be formed for connecting the carrier substrate to a multilayer circuit board. The through holes of the solder carrier, each of which holes is to be filled with solder, is formed by etching, and the solder is inserted in the holes under pressure by a roll or the like.

Abstract translation: 本发明涉及一种焊料载体，它包括一种自支撑型材料，它由熔化时不与焊料反应的材料制成，多个小通孔和填充通孔的焊料，每个小型 具有端部的通孔，其面积大于另一端的面积。 通过使用该焊料载体，可以通过凸块法将半导体器件倒装芯片连接到载体基板，并且可以形成用于将载体基板连接到多层电路板的焊球。 通过蚀刻形成每个要填充有焊料的孔的焊料载体的通孔，并且通过辊等将焊料插入孔中。

公开(公告)号：US4628616A

公开(公告)日：1986-12-16

申请号：US671872

申请日：1984-11-15

Applicant: Mitugu Shirai ,  Hideaki Sasaki ,  Sadatoshi Ueda ,  Akira Sawada

Inventor： Mitugu Shirai ,  Hideaki Sasaki ,  Sadatoshi Ueda ,  Akira Sawada

IPC: H05K3/34 ,  B23K1/015 ,  F22B1/28 ,  F27D7/02 ,  H05K13/04 ,  F26B19/00

CPC classification number: B23K1/015 ,  H05K13/0465 ,  Y10S165/908

Abstract: A vapor tank for processing a product by heating the same through exposure to vapor serving as a heat transfer medium. The vapor tank includes at least one partition wall separating a vapor chamber filled with vapor and a heating chamber for processing the product by heating the same for supplying a sufficient saturated vapor to the product. The partition wall is formed with openings for allowing the saturated vapor to be injected therethrough from the vapor chamber into the heating chamber where the product is enveloped by the saturated vapor. The vapor tank is provided with a recovery device for recovering the vapor flowing out of the tank through an inlet and an outlet for introducing and discharging the product into and out of the tank with a high degree of vapor recovering efficiency and with a minimum loss of energy. The vapor tank is also provided with a mechanism for externally supplying air currents to prevent the vapor from flowing out of the tank through the inlet and the outlet.

Abstract translation: 一种用于通过将其暴露于作为传热介质的蒸气进行加热来加工产品的蒸气罐。 蒸汽箱包括至少一个分隔出蒸气的蒸气室的分隔壁和加热室，用于通过加热产品来加热产品，以便向产品供应足够的饱和蒸气。 分隔壁形成有开口，用于使饱和蒸汽从蒸汽室注入到加热室中，在该加热室中产物被饱和蒸气包围。 蒸气罐设置有回收装置，用于通过入口和出口回收从罐中流出的蒸汽，用于以高回收蒸气回收效率将产物引入和排出罐，并以最小的损失 能源。 蒸汽箱还设置有用于从外部供应气流以防止蒸气通过入口和出口流出罐的机构。

公开(公告)号：US5801350A

公开(公告)日：1998-09-01

申请号：US619186

申请日：1996-03-21

Applicant: Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

Inventor： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC: C08J7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H05K3/305 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K3/22 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809

Abstract: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

Abstract translation: 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

公开(公告)号：US5709338A

公开(公告)日：1998-01-20

申请号：US636186

申请日：1996-04-22

Applicant: Mitugu Shirai ,  Hideaki Sasaki ,  Takeshi Takahashi

Inventor： Mitugu Shirai ,  Hideaki Sasaki ,  Takeshi Takahashi

IPC: B23K1/00 ,  B23K35/26 ,  H05K3/34 ,  B23K1/19 ,  B23K35/14 ,  B23K35/24

CPC classification number: B23K1/0016 ,  B23K35/26 ,  H05K3/3463 ,  B23K2201/36 ,  B23K35/262 ,  B23K35/268 ,  H05K2201/10992 ,  H05K3/341 ,  H05K3/3457

Abstract: A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil portion having a lower melting point. Initially, the part is held to the metallization by the solder chip having the higher melting point. The solder foil having the lower melting point is first melted in such a state and, after that, the solder chip having the higher melting point is melted. By such a soldering method, a reliable soldering can be performed, without causing a void on the undersurface of a part joint section, by one soldering operation, so that a presoldering operation becomes unnecessary.

Abstract translation: 以这样的方式进行焊接，使得具有不同熔点的两个焊料部分放置在用于接合的基板上的金属化和一部分之间。 使具有较高熔点的芯片部分比具有较低熔点的焊料箔部分厚。 最初，通过具有较高熔点的焊料芯片将部件保持在金属化之上。 具有较低熔点的焊料箔在这种状态下首先被熔化，之后熔化熔点较高的焊料芯片。 通过这样的焊接方法，可以通过一次焊接操作来进行可靠的焊接，而不会在部分接合部的下表面上产生空隙，从而不需要预焊工艺。

公开(公告)号：US6132221A

公开(公告)日：2000-10-17

申请号：US64197

申请日：1998-04-22

Applicant: Kiyoshi Matsui ,  Takayuki Ono ,  Kenichi Kasai ,  Tsutomu Imai ,  Morio Suzuki ,  Hideyuki Fukasawa ,  Mitugu Shirai ,  Toshitaka Murakawa ,  Takeji Siokawa ,  Takeshi Kuroda

Inventor： Kiyoshi Matsui ,  Takayuki Ono ,  Kenichi Kasai ,  Tsutomu Imai ,  Morio Suzuki ,  Hideyuki Fukasawa ,  Mitugu Shirai ,  Toshitaka Murakawa ,  Takeji Siokawa ,  Takeshi Kuroda

IPC: H01R12/04 ,  H01R43/02 ,  H05K3/30 ,  H05K7/10 ,  H01R12/00

CPC classification number: H05K3/303 ,  H01R43/0256 ,  H05K7/1084 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2203/0195 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.

Abstract translation: 用于在主板上安装其它板或电子部件的多针连接器具有固定焊接到主板上所需位置的有底连接孔中的接触销，使得接触销被单独固定并以所需形式排列 没有住房。 接触销具有接触部分和销部分，其中销部分固定在连接孔中。

公开(公告)号：US5926375A

公开(公告)日：1999-07-20

申请号：US626940

申请日：1996-04-03

Applicant: Hideki Watanabe ,  Tsutomu Imai ,  Takeshi Yamaguchi ,  Tositada Netsu ,  Kenichi Kasai ,  Fumio Imahashi ,  Satoru Ezaki ,  Mitugu Shirai

Inventor： Hideki Watanabe ,  Tsutomu Imai ,  Takeshi Yamaguchi ,  Tositada Netsu ,  Kenichi Kasai ,  Fumio Imahashi ,  Satoru Ezaki ,  Mitugu Shirai

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K1/112 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10704 ,  H05K3/4007 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.

Abstract translation: 电路板上设置有填充有焊料的盲孔连接孔。 电子部件的销的端部插入到连接通孔中，并通过焊料连接到连接通孔。 电子元件表面安装在电路板上，引脚的主要部分被暴露。

公开(公告)号：US5151773A

公开(公告)日：1992-09-29

申请号：US676389

申请日：1991-03-28

Applicant: Kiyoshi Matsui ,  Ryohei Satoh ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai ,  Kenichi Hamamura

Inventor： Kiyoshi Matsui ,  Ryohei Satoh ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai ,  Kenichi Hamamura

IPC: H01L23/10

CPC classification number: H01L23/10 ,  H01L2924/0002 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16315

Abstract: An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.

Abstract translation: 将电子电路部件安装到多路接线基板等上以与诸如LSI的电子电路一起使用的电子电路装置通过密封单元密封。 密封单元由指定为上板密封单元的上板和指定为侧板密封单元的侧板密封，侧板的横截面的边缘的形状为凸形或圆形。 金属化应用于基板和侧板之间以及侧板和上板之间的焊接部分，并且由支撑柱提供预定的焊点高度以实现焊料接合。

公开(公告)号：US06423405B1

公开(公告)日：2002-07-23

申请号：US09384105

申请日：1999-08-27

Applicant: Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

Inventor： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC: B32B712

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/22 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809 ,  H01L2924/00

Abstract: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

Abstract translation: 公开了一种高分子材料的表面改性方法，使得通过仅在其上将电子部件等暂时固定在预定区域上的预定区域照射和准分子激光束，所述预定区域通过液体在具有高聚合物层的基底上 仅用于临时固定的液体的表面润湿性相对于预定面积得到改善。 在通过使用该方法将电子部件暂时固定在基板上之后，可以通过无电流回流焊接将电子部件焊接在优选的耐久性上。

公开(公告)号：US06227436B1

公开(公告)日：2001-05-08

申请号：US09160288

申请日：1998-09-25

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC: B23K3102

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/757 ,  H01L2224/7901 ,  H01L2224/81012 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

Abstract translation: 在将诸如电子电路器件的两个部件焊接在氧化物或污染层已经从焊料或焊盘的表面除去之后，例如，这些部件在氧化气氛中排列。 然后将焊料材料在非氧化气氛中加热以熔化焊料并结合该构件。 通过溅射清洗，激光清洗，机械抛光或切割来进行焊料或焊盘的清洁。