发明授权
- 专利标题： Soldering alloy, cream solder and soldering method
- 专利标题（中）： 焊接合金，膏状焊料和焊接方法
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申请号： US792128申请日： 1997-01-31
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公开(公告)号： US5918795A公开(公告)日： 1999-07-06
- 发明人: Atsushi Yamaguchi , Tetsuo Fukushima
- 申请人： Atsushi Yamaguchi , Tetsuo Fukushima
- 申请人地址： JPX
- 专利权人： Matshushita Electric Industrial Co., Ltd.
- 当前专利权人： Matshushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX8-023547 19960209
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K31/02 ; B23K35/02 ; B23K35/14 ; B23K35/22 ; B23K35/26 ; C22C13/02 ; H05K3/34
摘要：
The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic substance. An addition of a small quantity of Ag to the soldering alloy can fine the alloy structure, minimize structural changes of the alloy and increase thermal fatigue resistance thereof. An addition of a small quantity of Bi to the soldering alloy lowers the melting point and improves the wettability thereof. Further, an addition of a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, an addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.
公开/授权文献
- US5146981A Substrate to heatsink interface apparatus and method 公开/授权日：1992-09-15
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