发明授权
- 专利标题： Method of planarizing semiconductor wafers
- 专利标题（中）： 平面化半导体晶片的方法
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申请号： US889994申请日： 1997-07-10
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公开(公告)号： US5935869A公开(公告)日： 1999-08-10
- 发明人: Cuc Huynh , Rangarajan Jagannathan , Amarnath Jha , Thomas Martin , Keith Pope , Thomas Sandwick
- 申请人： Cuc Huynh , Rangarajan Jagannathan , Amarnath Jha , Thomas Martin , Keith Pope , Thomas Sandwick
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; C11D7/32 ; C11D7/50 ; C11D11/00 ; H01L21/306 ; H01L21/00
摘要：
A CMP semiconductor wafer planarization method is provided employing an aqueous solution of a trialkanol amine as a wafer cleaning solution. Wafers are produced exhibiting a substantial reduction in semiconductor device failures as shown by a significant decrease in m.sub.1- m.sub.1 (metal to metal) shorts.