发明授权
- 专利标题： Vacuum processing apparatus
- 专利标题（中）： 真空加工设备
-
申请号： US803008申请日： 1997-02-21
-
公开(公告)号： US5951772A公开(公告)日： 1999-09-14
- 发明人: Kimihiro Matsuse , Hideki Lee , Hatsuo Osada , Sumi Tanaka
- 申请人： Kimihiro Matsuse , Hideki Lee , Hatsuo Osada , Sumi Tanaka
- 申请人地址： JPX Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX5-232340 19930825; JPX5-254683 19930917; JPX5-254684 19930917; JPX5-254685 19930917; JPX5-254686 19930917; JPX5-256505 19930920; JPX6-036425 19940208
- 主分类号： C23C8/06
- IPC分类号： C23C8/06 ; C23C16/44 ; C23C16/455 ; H01L21/00 ; C23C16/00
摘要：
A vacuum processing apparatus includes: a vacuum processing chamber for processing a target object; a processing gas supply source for supplying a processing gas by which a process is performed to the target object in the vacuum processing chamber; a processing gas supply pipe for supplying the processing gas from the processing gas supply source into the vacuum processing chamber; and a pressure reducing valve for keeping the gas supply pipe at a lower pressure than the atmospheric pressure when the processing gas is to be supplied to the vacuum processing chamber.
信息查询
IPC分类:
