Invention Grant
- Patent Title: Semiconductor device including an improved terminal structure
- Patent Title (中): 包括改进的端子结构的半导体器件
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Application No.: US890376Application Date: 1997-07-11
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Publication No.: US5959324APublication Date: 1999-09-28
- Inventor: Yusuke Kohyama
- Applicant: Yusuke Kohyama
- Applicant Address: JPX
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JPX
- Priority: JPX4-74485 19920330
- Main IPC: H01L27/04
- IPC: H01L27/04 ; H01L21/822 ; H01L21/8242 ; H01L27/10 ; H01L27/108 ; H01L29/76 ; H01L29/94
Abstract:
A semiconductor device includes a first N-type region formed in a P-type silicon substrate, trenches formed in the substrate, second N-type regions each formed from at least the bottom of a corresponding one of the trenches into the substrate, these second N-type regions contacting each other to constitute a wiring layer and being also in contact with the first N-type region, and an electrode for applying a predetermined potential to the second N-type regions via the first N-type region. Since a potential is supplied to the wiring layer formed in the substrate via the first N-type region, no special design, such as formation of a terminal trench, is required. A potential can be easily supplied to the wiring layer formed in the semiconductor substrate, and the device can be easily fabricated.
Public/Granted literature
- US5202372A Curable compositions based on fluoroelastomers vulcanizable with peroxides Public/Granted day:1993-04-13
Information query
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