发明授权
US5972560A High molecular weight silicone compound, chemically amplified positive
resist composition and patterning method
失效
高分子量硅氧烷化合物，化学放大正性抗蚀剂组合物和图案化方法
- 专利标题： High molecular weight silicone compound, chemically amplified positive resist composition and patterning method
- 专利标题（中）： 高分子量硅氧烷化合物，化学放大正性抗蚀剂组合物和图案化方法
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申请号： US16448申请日： 1998-01-30
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公开(公告)号： US5972560A公开(公告)日： 1999-10-26
- 发明人: Ichiro Kaneko , Mutsuo Nakashima , Toshinobu Ishihara , Junji Tsuchiya , Jun Hatakeyama , Shigehiro Nagura
- 申请人： Ichiro Kaneko , Mutsuo Nakashima , Toshinobu Ishihara , Junji Tsuchiya , Jun Hatakeyama , Shigehiro Nagura
- 申请人地址： JPX
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX9-033082 19970131; JPX9-095104 19970328
- 主分类号： C08G77/50
- IPC分类号： C08G77/50 ; C08L83/14 ; G03F7/004 ; G03F7/075 ; C08G77/04
摘要：
The invention provides a high molecular weight silicone compound comprising recurring units of the general formula (1) and having a weight average molecular weight of 1,000-50,000. ##STR1## Z is a di- to hexavalent, monocyclic or polycyclic hydrocarbon group or bridged cyclic hydrocarbon group of 5-12 carbon atoms, R.sup.1 is a substituted or unsubstituted alkyl or alkenyl group of 1-8 carbon atoms, R.sup.2 is an acid labile group, m is 0 or an integer, n is an integer, satisfying m+n.ltoreq.5, x is an integer, p1 and p2 are positive numbers, q is 0 or a positive number, satisfying 0
公开/授权文献
- US5722038A Mold element construction and related method 公开/授权日：1998-02-24
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