发明授权
- 专利标题： Package for semiconductor device laminated printed circuit boards
- 专利标题（中）： 半导体器件层压印刷电路板封装
-
申请号： US738935申请日： 1996-10-24
-
公开(公告)号： US6005289A公开(公告)日： 1999-12-21
- 发明人: Masaki Watanabe , Akiyoshi Sawai , Yoshikazu Narutaki , Tomoaki Hashimoto , Masatoshi Yasunaga , Jun Shibata , Hiroshi Seki , Kazuhiko Kurafuchi , Katsunori Asai
- 申请人： Masaki Watanabe , Akiyoshi Sawai , Yoshikazu Narutaki , Tomoaki Hashimoto , Masatoshi Yasunaga , Jun Shibata , Hiroshi Seki , Kazuhiko Kurafuchi , Katsunori Asai
- 申请人地址： JPX Tokyo JPX Hyogo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha,Ryoden Semiconductor System Engineering Corporation
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha,Ryoden Semiconductor System Engineering Corporation
- 当前专利权人地址： JPX Tokyo JPX Hyogo
- 优先权： JPX8-074571 19960328
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H01L21/48 ; H01L23/12 ; H01L23/13 ; H01L23/367 ; H01L23/498 ; H01L23/053 ; H01L23/48
摘要：
The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layers can be formed easily with small spaces between wires.
公开/授权文献
- USD335990S Razor holder for a shower or bath 公开/授权日：1993-06-01
信息查询
