公开(公告)号：US20140257764A1

公开(公告)日：2014-09-11

申请号：US14349247

申请日：2011-10-03

Applicant: Hiroshi Seki ,  Satoshi Shimakura

Inventor： Hiroshi Seki ,  Satoshi Shimakura

IPC: G06F17/50

CPC classification number: G06F17/5004 ,  G06Q10/0631 ,  G06Q10/103 ,  G06Q50/08

Abstract: The object is to enable easy acquisition of an element that is not design data. The technique is characterized in that when generating construction field management information used to manage a construction field, a construction field management device acquires measurement data that is three-dimensional shape data measured by a measurement device, and compares design data created by a designer with the acquired measurement data, thus extracting non-design data that is not the design data, from the measurement data. Also, as the non-design data, data of a scaffolding/tool and a component of the design data in a temporarily placed state are extracted, and the status of these is analyzed and displayed on a display unit.

Abstract translation: 目的是使得能够轻松获取不是设计数据的元素。 该技术的特征在于，当生成用于管理建筑领域的施工现场管理信息时，施工现场管理装置获取由测量装置测量的三维形状数据的测量数据，并将设计者创建的设计数据与 获取测量数据，从而从测量数据中提取非设计数据的非设计数据。 此外，作为非设计数据，提取脚手架/工具的数据和处于暂时放置状态的设计数据的分量，并且将它们的状态分析并显示在显示单元上。

公开(公告)号：US20110074551A1

公开(公告)日：2011-03-31

申请号：US12890265

申请日：2010-09-24

Applicant: Masaru HIGASHIONJI ,  Kenji Hasegawa ,  Masaru Odagiri ,  Masafumi Shimotashiro ,  Hiroshi Seki

Inventor： Masaru HIGASHIONJI ,  Kenji Hasegawa ,  Masaru Odagiri ,  Masafumi Shimotashiro ,  Hiroshi Seki

IPC: H04Q5/22

CPC classification number: G06K7/0008 ,  A61J1/14 ,  A61J2200/76 ,  A61J2205/60 ,  A61M5/14 ,  A61M2205/3592 ,  A61M2205/6018 ,  B41J3/44 ,  B41J13/103 ,  B41J29/393 ,  G01F23/0069 ,  G01F23/284 ,  G01F23/2962 ,  G01F23/2968 ,  G01F23/68 ,  G06K19/0701 ,  G06K19/0715

Abstract: A radio-type transmitting device capable of transmitting information other than information in an internal memory is provided. A RFID tag includes a encoding circuit for digitalizing receiving sensitivity of a radio wave sent from an external transmitting/receiving apparatus and then sending the digitalized receiving sensitivity to the external transmitting/receiving apparatus. Thus, the external transmitting/receiving apparatus can obtain a distance between the external transmitting/receiving apparatus and the RFID tag based on received sensitivity information.

Abstract translation: 提供一种能够在内部存储器中发送信息以外的信息的无线电型发送装置。 RFID标签包括编码电路，用于对从外部发送/接收装置发送的无线电波的接收灵敏度进行数字化，然后将数字化接收灵敏度发送到外部发送/接收装置。 因此，外部发送/接收装置可以基于接收的灵敏度信息获得外部发送/接收装置与RFID标签之间的距离。

公开(公告)号：US07656210B2

公开(公告)日：2010-02-02

申请号：US11404033

申请日：2006-04-13

Applicant: Hiroshi Seki ,  Hideyuki Kakubari ,  Hiroshi Tokiwai

Inventor： Hiroshi Seki ,  Hideyuki Kakubari ,  Hiroshi Tokiwai

IPC: H03K3/03

CPC classification number: H03K19/0013

Abstract: A semiconductor integrated circuit that operates on multiple supply potentials including a first potential and a second potential that is higher than the first potential. The semiconductor integrated circuit includes a potential-lowering circuit operating on the second supply potential and including an N-channel MOS transistor that lowers the second supply potential applied to a gate thereof to output a lowered potential from a source thereof, a judging circuit operating on the potential outputted from the potential-lowering circuit and judging whether the first supply potential is high-level or low-level, and a buffer circuit outputting a control signal showing whether the first supply potential is fed based on judgment outputted from the judging circuit.

Abstract translation: 一种半导体集成电路，其操作多个电源电位，包括高于第一电位的第一电位和第二电位。 半导体集成电路包括在第二电源电位上工作的电位降低电路，并且包括N沟道MOS晶体管，其降低施加到其栅极的第二电源电位，以从其源极输出降低的电位，判断电路工作在 从电位降低电路输出的电位，判断第一电源电位是高电平还是低电平，以及缓冲电路，根据从判断电路输出的判断，输出表示是否送入第一供电电位的控制信号。

公开(公告)号：US07525832B2

公开(公告)日：2009-04-28

申请号：US11883653

申请日：2006-04-21

Applicant: Shunsaku Muraoka ,  Koichi Osano ,  Satoru Mitani ,  Hiroshi Seki

Inventor： Shunsaku Muraoka ,  Koichi Osano ,  Satoru Mitani ,  Hiroshi Seki

IPC: G11C11/00

CPC classification number: H01L27/1021 ,  G11C11/5685 ,  G11C13/0007 ,  G11C2213/31 ,  G11C2213/32 ,  G11C2213/55 ,  G11C2213/56 ,  G11C2213/72 ,  H01L27/2463 ,  H01L27/2472 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/147

Abstract: First electrode layer includes a plurality of first electrode lines (W1, W2) extending parallel to each other. State-variable layer lying on the first electrode layer includes a plurality of state-variable portions (60-11, 60-12, 60-21, 60-22) which exhibits a diode characteristic and a variable-resistance characteristic. Second electrode layer lying on the state-variable layer includes a plurality of second electrode lines (B1, B2) extending parallel to each other. The plurality of first electrode lines and the plurality of second electrode lines are crossing each other when seen in a layer-stacking direction with the state-variable layer interposed therebetween. State-variable portion (60-11) is provided at an intersection of the first electrode line (W1) and the second electrode line (B1) between the first electrode line and the second electrode line.

Abstract translation: 第一电极层包括彼此平行延伸的多个第一电极线（W1，W2）。 位于第一电极层上的状态变化层包括多个具有二极管特性和可变电阻特性的状态变化部分（60-11,60-12,60-21,60-22）。 位于状态变化层上的第二电极层包括彼此平行延伸的多个第二电极线（B1，B2）。 多个第一电极线和多个第二电极线在层叠方向观察时彼此交叉，其间置有状态变化层。 状态可变部（60-11）设置在第一电极线和第二电极线之间的第一电极线（W1）和第二电极线（B1）的交叉点。

公开(公告)号：US20060232320A1

公开(公告)日：2006-10-19

申请号：US11404033

申请日：2006-04-13

Applicant: Hiroshi Seki ,  Hideyuki Kakubari ,  Hiroshi Tokiwai

Inventor： Hiroshi Seki ,  Hideyuki Kakubari ,  Hiroshi Tokiwai

IPC: H03L5/00

CPC classification number: H03K19/0013

Abstract: A semiconductor integrated circuit that operates on multiple supply potentials including a first potential and a second potential that is higher than the first potential. The semiconductor integrated circuit includes a potential-lowering circuit operating on the second supply potential and including an N-channel MOS transistor that lowers the second supply potential applied to a gate thereof to output a lowered potential from a source thereof, a judging circuit operating on the potential outputted from the potential-lowering circuit and judging whether the first supply potential is high-level or low-level, and a buffer circuit outputting a control signal showing whether the first supply potential is fed based on judgment outputted from the judging circuit.

Abstract translation: 一种半导体集成电路，其操作多个电源电位，包括高于第一电位的第一电位和第二电位。 半导体集成电路包括在第二电源电位上工作的电位降低电路，并且包括N沟道MOS晶体管，其降低施加到其栅极的第二电源电位，以从其源极输出降低的电位，判断电路工作在 从电位降低电路输出的电位，判断第一电源电位是高电平还是低电平，以及缓冲电路，根据从判断电路输出的判断，输出表示是否送入第一供电电位的控制信号。

公开(公告)号：US06833517B2

公开(公告)日：2004-12-21

申请号：US09739686

申请日：2000-12-20

Applicant: Tsuyoshi Sotome ,  Osamu Furukawa ,  Hiroshi Seki ,  Hideo Hirai

Inventor： Tsuyoshi Sotome ,  Osamu Furukawa ,  Hiroshi Seki ,  Hideo Hirai

IPC: H01H900

CPC classification number: H01H25/00 ,  H01H13/562 ,  H01H21/22 ,  H01H23/164 ,  H01H25/008 ,  H01H25/06 ,  H01H2021/225 ,  H01H2300/01

Abstract: A low cost automotive power window switch having few window operating switches uses a single switch to select which of the four windows to operate, and to control the window locks. The power window switch has a window operating switch 3 for raising and lowering each of the car windows, and a mode selector switch 2 for switching between the windows. The mode selector switch 2 also has a window lock switch function for locking and unlocking the windows.

Abstract translation: 具有少量窗口操作开关的低成本汽车电动车窗开关使用单个开关来选择要操作的四个窗口中的哪一个，并且控制窗口锁。 电动车窗开关具有用于升高和降低每个车窗的窗口操作开关3和用于在窗户之间切换的模式选择器开关2。 模式选择开关2还具有用于锁定和解锁窗口的窗口锁定开关功能。

公开(公告)号：US5835078A

公开(公告)日：1998-11-10

申请号：US484814

申请日：1995-06-07

Applicant: Setsuo Arita ,  Yukiharu Ohga ,  Hiroyuki Yuchi ,  Hiroshi Seki ,  Yukio Nagaoka ,  Koichi Kawaguchi ,  Akira Kaji

Inventor： Setsuo Arita ,  Yukiharu Ohga ,  Hiroyuki Yuchi ,  Hiroshi Seki ,  Yukio Nagaoka ,  Koichi Kawaguchi ,  Akira Kaji

IPC: G05B23/02 ,  G06F3/038 ,  G06F3/042 ,  G09G5/08

CPC classification number: G06F3/0386 ,  G06F3/03542

Abstract: A pointer remotely points a display screen of a large screen display device. The display screen is picked up by a monitor camera. An image processing unit extracts a feature of the pointer used for pointing based on the resulting image signal to identify the position of the pointing point and the pointer based on the feature. A computer generates information on an object to be displayed at a position pointed by the pointer. The generated information is displayed on a display device (CRT display device or large screen display device) assigned to the pointer. Even when a plurality of pointers are used, the information on the object to be displayed pointed by the pointer is properly displayed.

Abstract translation: 远程指针指向大屏幕显示设备的显示屏幕。 显示屏由监视摄像机拾取。 图像处理单元基于所生成的图像信号提取用于指示的指针的特征，以基于特征来识别指向点和指针的位置。 计算机生成关于要在指针指向的位置显示的对象的信息。 生成的信息显示在分配给指针的显示装置（CRT显示装置或大屏幕显示装置）上。 即使使用多个指针，也可以适当地显示由指针指示的要显示的对象的信息。

公开(公告)号：US5309021A

公开(公告)日：1994-05-03

申请号：US961352

申请日：1992-10-15

Applicant: Haruo Shimamoto ,  Jun Shibata ,  Toru Tachikawa ,  Tetsuya Ueda ,  Hiroshi Seki

Inventor： Haruo Shimamoto ,  Jun Shibata ,  Toru Tachikawa ,  Tetsuya Ueda ,  Hiroshi Seki

IPC: H01L21/60 ,  H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34 ,  H01L39/02 ,  H01L23/58 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L23/49527 ,  H01L23/49517 ,  H05K3/341 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0263 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K3/3426 ,  Y02P70/613

Abstract: A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.

Abstract translation: 根据本发明的半导体器件具有减小电源线，接地线和信号线上的电感。 在本发明中，为了减小电源连接的长度和接地连接的长度，分别在半导体芯片的电源引线和半导体芯片的接地引线垂直地设置电源金属柱和接地金属柱 到线索 金属柱从封装芯片的树脂突出，并连接到印刷电路板上的焊盘或导电电路图案。 此外，提供通常连接电源或接地电位的平面导体。

公开(公告)号：US5157478A

公开(公告)日：1992-10-20

申请号：US810354

申请日：1991-12-18

Applicant: Tetsuya Ueda ,  Haruo Shimamoto ,  Yasuhiro Teraoka ,  Hideya Yagoura ,  Hiroshi Seki

Inventor： Tetsuya Ueda ,  Haruo Shimamoto ,  Yasuhiro Teraoka ,  Hideya Yagoura ,  Hiroshi Seki

IPC: H01L21/56 ,  H01L23/16 ,  H01L23/433 ,  H01L23/495

CPC classification number: H01L24/50 ,  H01L21/565 ,  H01L23/16 ,  H01L23/4334 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/16152 ,  H01L2924/3511

Abstract: A packaged semiconductor device includes an insulating film having an opening, a semiconductor chip disposed in the opening of the insulating film and having a plurality of electrodes, a plurality of leads, each having one end connected to a corresponding electrode, the plurality of leads being supported on the insulating film, a heat radiator disposed opposite and spaced from the semiconductor chip, and a resin package body encapsulating the semiconductor chip and part of the heat radiator, leaving a surface of the heat radiator externally exposed and the second ends of the plurality of leads extending outwardly from the package.

Abstract translation: 封装半导体器件包括具有开口的绝缘膜，设置在绝缘膜的开口中并具有多个电极的半导体芯片，多个引线，每个引线的一端连接到相应的电极，多个引线为 支撑在绝缘膜上，与半导体芯片相对且间隔开的散热器，以及封装半导体芯片和散热器的一部分的树脂封装体，使散热器的外表面露出，并且多个第二端 的引线从封装向外延伸。

公开(公告)号：US5099167A

公开(公告)日：1992-03-24

申请号：US489199

申请日：1990-03-06

Applicant: Atsushi Kimura ,  Hiroshi Seki

Inventor： Atsushi Kimura ,  Hiroshi Seki

IPC: B65G54/02 ,  B65G27/00 ,  H01L41/09 ,  H02N2/00 ,  H02N2/14

CPC classification number: H02N2/08

Abstract: In a vibration wave driven motor disclosed herein, the arcuate portions of the vibration member thereof are formed into a shape in which flexural rigidity differs between the inner side and the outer side thereof, or a shape in which the torsional rigidity of the straight portions of the vibration member is made higher than the torsional rigidity of the arcuate portions, whereby a torsion component produced in the straight portions is made small by the straight portions.

Abstract translation: 在这里公开的振动波驱动电动机中，其振动部件的弧形部分形成为其内侧和外侧之间的弯曲刚度不同的形状，或者其直线部分的直线部分的扭转刚度 振动部件被制成高于弧形部分的扭转刚度，由此直线部分产生的扭转部件变小。