Invention Grant
- Patent Title: Method for ultrasonic bonding flexible circuits
- Patent Title (中): 超声波接合柔性电路的方法
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Application No.: US893714Application Date: 1997-07-11
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Publication No.: US6019271APublication Date: 2000-02-01
- Inventor: Brian John Hayden , Cuong Van Pham , Rosa Lynda Nuno , Mark Stephen Topping
- Applicant: Brian John Hayden , Cuong Van Pham , Rosa Lynda Nuno , Mark Stephen Topping
- Applicant Address: MI Dearborn
- Assignee: Ford Motor Company
- Current Assignee: Ford Motor Company
- Current Assignee Address: MI Dearborn
- Main IPC: B23K20/10
- IPC: B23K20/10 ; H05K3/32 ; H05K3/36 ; H05K3/40 ; B23K1/06 ; B23K31/02 ; B32B31/16 ; H05K1/16
Abstract:
A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor. The members are then held together until each joint solidifies, and then the horn and/or anvil are retracted.
Public/Granted literature
- US5275031A Bend correction apparatus and method Public/Granted day:1994-01-04
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