公开(公告)号：US5921460A

公开(公告)日：1999-07-13

申请号：US870049

申请日：1997-06-05

Applicant: Mark Stephen Topping ,  Cuong Van Pham ,  Brian John Hayden

Inventor： Mark Stephen Topping ,  Cuong Van Pham ,  Brian John Hayden

IPC: B23K20/10 ,  H01L21/607 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L24/80 ,  B23K20/10 ,  H05K3/3494 ,  H05K3/363 ,  B23K2201/36 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K3/3421 ,  H05K3/3463

Abstract: A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate. The method facilitates making electrical connections for completing an electronic circuit unit that is supported on a low temperature melting substrate and comprises (a) positioning together first and second conductive terminals for said circuit with a solder deposit therebetween to form an assembly, at least one of the terminals of such assembly being supported directly on such low temperature melting substrate; (b) gripping the assembly between an ultrasonic motion generating horn and an anvil, while exciting the horn to apply ultrasonic vibration to the first terminal to provide sufficient shearing energy that frictionally rubs at least one surface of the solder deposit in a rubbing direction generally parallel to said one surface to rapidly heat and melt the solder deposit; and (c) essentially immediately upon the completion melting of the solder deposit, ceasing the application of ultrasonic shearing energy to allow the solder to solidify and form a soldered diffusion joint between the terminals.

Abstract translation: 一种通过控制超声能量来焊接材料的方法，以在仅在低温熔融基底上承载的待接合组件中仅熔化焊料。 该方法有助于进行电连接以完成支撑在低温熔融基板上的电子电路单元，并且包括（a）将第一和第二导电端子定位在所述电路之间，其间具有焊料沉积物以形成组件，至少一个 这种组件的端子直接支撑在这种低温熔融基板上; （b）在超声波发生喇叭和砧座之间夹持组件，同时激励喇叭以对第一端子施加超声波振动，以提供足够的剪切能量，其摩擦方向大致平行于摩擦方向摩擦焊料沉积物的至少一个表面 使所述一个表面快速加热和熔化所述焊料沉积物; 和（c）基本上在焊料沉积物完成熔化之后立即停止超声剪切能量的施加，以允许焊料固化并在端子之间形成焊接的扩散接头。

公开(公告)号：US6076950A

公开(公告)日：2000-06-20

申请号：US166247

申请日：1998-10-05

Applicant: Mark Stephen Topping ,  Michael G. Todd ,  Mark Miller

Inventor： Mark Stephen Topping ,  Michael G. Todd ,  Mark Miller

IPC: F21K99/00 ,  F21S8/10 ,  B60Q1/00

CPC classification number: F21S48/215 ,  F21S48/212 ,  F21S48/22 ,  F21S48/23 ,  F21S48/24 ,  F21Y2101/00 ,  Y10S362/80

Abstract: An integrated lighting assembly (10) includes an injection molded housing that has a base (12) with first fastening elements (22) molded thereon, a cover (18) with second fastening elements (24) molded thereon, and a substrate (16) intermediate the base and cover. An electrical circuit (30) is formed on the substrate and a lighting element (32) is attached to the electrical circuit. A reflective cone (34, 36) surrounds the lighting element to intensify its light and direct light through a diffuser lens (28) formed on the base. A reflective wall (26) on the base reflects light emanating from the diffuser lens in a predetermined pattern. Metal for the reflective surface and electrical circuit is deposited in a single operation. The base and cover are connected to the substrate by living hinges. When the cover is folded onto the base, the first and second fastening elements snap together to form a three dimensional lighting assembly.

Abstract translation: 集成照明组件（10）包括注射模制的壳体，其具有在其上模制有第一紧固元件（22）的基部（12），具有模制在其上的第二紧固元件（24）的盖子（18） 在基座和盖子之间。 在基板上形成有电路（30），并且将照明元件（32）安装在电路上。 反射锥体（34,36）围绕照明元件，以加强其光线并将光引导通过形成在基座上的漫射器透镜（28）。 基座上的反射壁（26）以预定图案反射从扩散器透镜发出的光。 用于反射表面和电路的金属在单次操作中沉积。 基座和盖通过活动铰链连接到基板。 当盖子折叠到基座上时，第一和第二紧固元件卡在一起以形成三维照明组件。

公开(公告)号：US6019271A

公开(公告)日：2000-02-01

申请号：US893714

申请日：1997-07-11

Applicant: Brian John Hayden ,  Cuong Van Pham ,  Rosa Lynda Nuno ,  Mark Stephen Topping

Inventor： Brian John Hayden ,  Cuong Van Pham ,  Rosa Lynda Nuno ,  Mark Stephen Topping

IPC: B23K20/10 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  B23K1/06 ,  B23K31/02 ,  B32B31/16 ,  H05K1/16

CPC classification number: H05K3/361 ,  B23K20/103 ,  B23K2201/38 ,  B23K2201/42 ,  H05K2201/10356 ,  H05K2203/0285 ,  H05K2203/1189 ,  H05K3/328 ,  H05K3/4084

Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor. The members are then held together until each joint solidifies, and then the horn and/or anvil are retracted.

Abstract translation: 一种用于将至少两个导电构件20结合在一起的方法，其中每个构件包括具有相应接合区域24的至少一个金属22.至少一个构件在每个接合区域附近附着到每个相应导体上的金属接合材料26的沉积， 并且至少一个构件具有附接到每个相应接合区域的塑料元件28。 构件20定位在预定取向上，夹在超声波喇叭和砧座之间，压力和正交的超声能量被施加到其上，使得每个塑料元件28被加热，这再次熔化接合材料26.任何塑料元件 导体之间的材料被挤压掉，各导体22彼此接近，使得接合材料的熔融接头物理地接触每个相应的导体。 然后将构件保持在一起直到每个接头固化，然后将喇叭和/或砧座缩回。