Invention Grant
- Patent Title: Semiconductor chip
- Patent Title (中): 半导体芯片
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Application No.: US930947Application Date: 1997-10-10
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Publication No.: US6020050APublication Date: 2000-02-01
- Inventor: Ulrich Naher , Adrian Berthold , Thomas Scheiter , Christofer Hierold
- Applicant: Ulrich Naher , Adrian Berthold , Thomas Scheiter , Christofer Hierold
- Applicant Address: DEX Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DEX Munich
- Priority: DEX19513921 19950412
- Main IPC: G01L9/12
- IPC: G01L9/12 ; G01L1/14 ; G01L9/00 ; G01P15/08 ; G01P15/125 ; H01L29/84 ; B32B3/00 ; H01L23/12
Abstract:
A semiconductor chip has a membrane mounted on supports that are held in the material of the chip so that the membrane is supported at a space from the chip. The membrane may be a metal layer. The supports are columns or webs that extend into the chip material. Electrical connections to the membrane may be made by conductive supports.
Public/Granted literature
- US5292134A Ball catching and launching toy Public/Granted day:1994-03-08
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