发明授权
- 专利标题: Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
- 专利标题(中): 具有导电组合物连接器的多层电路基板和电气组件
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申请号: US203126申请日: 1998-12-01
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公开(公告)号: US6054761A公开(公告)日: 2000-04-25
- 发明人: Mark Thomas McCormack , Hunt Hang Jiang , Solomon I. Beilin , Albert Wong Chan , Yasuhito Takahashi
- 申请人: Mark Thomas McCormack , Hunt Hang Jiang , Solomon I. Beilin , Albert Wong Chan , Yasuhito Takahashi
- 申请人地址: JPX
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JPX
- 主分类号: C08K3/00
- IPC分类号: C08K3/00 ; C08L63/00 ; H01L23/498 ; H05K3/40 ; H05K3/46 ; H01L23/04
摘要:
Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400.degree. C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25.degree. C.
公开/授权文献
- US5380276A Dual lumen catheter and method of use 公开/授权日:1995-01-10