发明授权
US6114247A Polishing cloth for use in a CMP process and a surface treatment thereof
失效
用于CMP工艺的抛光布及其表面处理
- 专利标题： Polishing cloth for use in a CMP process and a surface treatment thereof
- 专利标题（中）： 用于CMP工艺的抛光布及其表面处理
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申请号： US884549申请日： 1997-06-27
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公开(公告)号： US6114247A公开(公告)日： 2000-09-05
- 发明人: Ko Nakamura , Sadahiro Kishii , Yoshihiro Arimoto
- 申请人： Ko Nakamura , Sadahiro Kishii , Yoshihiro Arimoto
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX8-168041 19960627; JPX8-347918 19961226
- 主分类号： B24B53/017
- IPC分类号： B24B53/017 ; B24D11/00 ; B24D13/12 ; C09G1/02 ; H01L21/02 ; H01L21/304 ; H01L21/3105 ; H01L21/321 ; H01L21/302
摘要：
A method of fabricating a semiconductor device includes a step of polishing a surface of a substrate by a chemical mechanical polishing process conducted on a polishing cloth by a slurry. The polishing is conducted so that projections having a height of about 30 .mu.m or less are formed on the polishing cloth with an interval of about 55 .mu.m or less as a result of the polishing.
公开/授权文献
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