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US6117367A Pastes for improved substrate dimensional control 失效
用于改善基材尺寸控制的糊剂

Pastes for improved substrate dimensional control
摘要:
Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.
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