公开(公告)号：US6117367A

公开(公告)日：2000-09-12

申请号：US21045

申请日：1998-02-09

申请人： Raschid J. Bezama ,  Michael A. Cohn ,  Benjamin V. Fasano ,  Gregory M. Johnson ,  Robert A. Rita ,  Rao V. Vallabhaneni ,  Nancy A. Wier-Cavalieri

发明人： Raschid J. Bezama ,  Michael A. Cohn ,  Benjamin V. Fasano ,  Gregory M. Johnson ,  Robert A. Rita ,  Rao V. Vallabhaneni ,  Nancy A. Wier-Cavalieri

IPC分类号： H05K3/46 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  H01B1/02 ,  H01C1/02

CPC分类号： H01L23/49883 ,  H01B1/16 ,  H01B1/22 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/092

摘要： Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.

摘要翻译： 用于制造半导体器件中使用的多层陶瓷（MLC）基板的金属浆料。 糊剂可减少底物缺陷，例如通过凸起和弯度。 糊料由具有高导电性的金属组成，玻璃料包括玻璃，有机粘合剂和溶剂，任选地含有表面活性剂。

公开(公告)号：US5783113A

公开(公告)日：1998-07-21

申请号：US829809

申请日：1997-03-27

申请人： Jawahar P. Nayak ,  Michael E. Cropp ,  John M. Wargo ,  Nancy A. Wier-Cavalieri ,  Charles W. Hunter, Jr.

发明人： Jawahar P. Nayak ,  Michael E. Cropp ,  John M. Wargo ,  Nancy A. Wier-Cavalieri ,  Charles W. Hunter, Jr.

IPC分类号： H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  H01B1/20

CPC分类号： H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/092

摘要： Deformation of vias and shorting between vias during screening of conductive paste onto greensheets wider than 185 mm is avoided by a concentration of thixotropic agent in the conductive paste formulation to a concentration which raises the thixotropic index of the paste to within 5% to 25% of the maximum achievable thixotropic index for the organic vehicle in the paste. For a paste containing molybdenum powder in which the organic vehicle is a mixture of ethyl cellulose, texanol and oleoyl sarcosine, this criterion corresponds to a concentration of glycerl tri(-12-hydroxystearate) in the range of 1.4% to 1.8% by weight.

公开(公告)号：US5951917A

公开(公告)日：1999-09-14

申请号：US35948

申请日：1998-03-06

申请人： Jawahar P. Nayak ,  Michael E. Cropp ,  John M. Wargo ,  Nancy A. Wier-Cavalieri ,  Charles W. Hunter, Jr.

发明人： Jawahar P. Nayak ,  Michael E. Cropp ,  John M. Wargo ,  Nancy A. Wier-Cavalieri ,  Charles W. Hunter, Jr.

IPC分类号： H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  H01B1/20

CPC分类号： H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/092

摘要： Deformation of vias and shorting between vias during screening of conductive paste onto greensheets wider than 185 mm is avoided by a concentration of thixotropic agent in the conductive paste formulation to a concentration which raises the thixotropic index of the paste to within 5% to 25% of the maximum achievable thixotropic index for the organic vehicle in the paste. For a paste containing molybdenum powder in which the organic vehicle is a mixture of ethyl cellulose, texanol and oleoyl sarcosine, this criterion corresponds to a concentration of glycerl tri(-12-hydroxystearate) in the range of 1.4% to 1.8% by weight.

摘要翻译： 通过在导电浆料配方中将触变剂浓度提高到膏体的触变指数的5％至25％以内的浓度，可以避免在将导电浆料过滤到宽度大于185mm的绿色薄片上时，通孔和通孔之间的短路。 糊料中有机载体的最大可达到的触变指数。 对于含有钼载体的糊状物，其中有机载体是乙基纤维素，德克萨
文蛋白和油酰肌氨酸的混合物，该标准对应于甘油三（-12-羟基硬脂酸酯）在1.4重量％至1.8重量％范围内的浓度。