A method for making a silicon stylus protruding through a nitride layer is used to fabricate nitride micro-apertures, silicon styluses supported by nitride cantilever arms and charge sensitive silicon styluses supported by nitride cantilever arms. The method uses an anisotropic dry etch to define the apertures of the nitride micro-apertures and the apexes of the silicon styluses. Nitride apertures made by this method are useful for supporting micro-electronics and micro-optical devices. Surface probing devices with silicon styluses supported by nitride cantilever arms have applications in AFM and STM and are particularly useful in applications that require an electrical connection between the silicon stylus and external circuitry through the cantilever arm.