Multilayer laminated substrates with high density interconnects and methods of making the same

发明授权

US6163957A Multilayer laminated substrates with high density interconnects and methods of making the same 失效

标题翻译：具有高密度互连的多层叠层基板及其制造方法

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专利标题： Multilayer laminated substrates with high density interconnects and methods of making the same
专利标题（中）： 具有高密度互连的多层叠层基板及其制造方法
申请号： US192003

申请日： 1998-11-13
公开(公告)号： US6163957A

公开(公告)日： 2000-12-26
发明人: Hunt Hang Jiang , Thomas Massingill , Mark Thomas McCormack , Michael Guang-Tzong Lee
申请人： Hunt Hang Jiang , Thomas Massingill , Mark Thomas McCormack , Michael Guang-Tzong Lee
申请人地址： JPX
专利权人： Fujitsu Limited
当前专利权人： Fujitsu Limited
当前专利权人地址： JPX
主分类号： H01R12/04
IPC分类号： H01R12/04 ; H01L21/48 ; H01L23/538 ; H05K1/14 ; H05K3/00 ; H05K3/12 ; H05K3/28 ; H05K3/36 ; H05K3/40 ; H05K3/46 ; H01K3/10

Multilayer laminated substrates with high density interconnects and
methods of making the same

摘要：

Multilayer circuit lamination methods and circuit layer structures are disclosed which enable one to manufacture high-density multichip module boards and the like at lower cost, with higher yield, with higher signal densities, and with fewer processing steps.

摘要（中）：

公开了多层电路层叠方法和电路层结构，其能够以更低的成本，更高的产量，更高的信号密度和更少的处理步骤来制造高密度多芯片模块板等。

公开/授权文献

US5451558A Process for the reaction and absorption of gaseous air pollutants, apparatus therefor and method of making the same 公开/授权日：1995-09-19

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