发明授权
- 专利标题： Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
- 专利标题（中）： 半导体封装环氧树脂组合物和封装的半导体器件
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申请号： US09291285申请日： 1999-04-14
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公开(公告)号： US06221509B1公开(公告)日： 2001-04-24
- 发明人: Tatsurou Hirano , Nobukazu Suzuki , Toshio Shiobara , Takayuki Aoki , Shoichi Osada
- 申请人： Tatsurou Hirano , Nobukazu Suzuki , Toshio Shiobara , Takayuki Aoki , Shoichi Osada
- 优先权： JP10-122805 19980416
- 主分类号： H01L2912
- IPC分类号： H01L2912
摘要：
In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.