发明授权
- 专利标题： Semiconductor encapsulating epoxy resin composition and semiconductor device
- 专利标题（中）： 半导体封装环氧树脂组合物和半导体器件
-
申请号： US09310924申请日： 1999-05-13
-
公开(公告)号： US06297306B1公开(公告)日： 2001-10-02
- 发明人: Shoichi Osada , Takayuki Aoki , Toshio Shiobara , Kazutoshi Tomiyoshi , Eiichi Asano
- 申请人： Shoichi Osada , Takayuki Aoki , Toshio Shiobara , Kazutoshi Tomiyoshi , Eiichi Asano
- 优先权： JP10-152072 19980515
- 主分类号： C08K310
- IPC分类号： C08K310
摘要：
An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.