发明授权
- 专利标题： Thin film wiring scheme utilizing inter-chip site surface wiring
- 专利标题（中）： 薄片布线方案采用片间现场表面布线
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申请号： US08477054申请日： 1995-06-07
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公开(公告)号： US06444919B1公开(公告)日： 2002-09-03
- 发明人: Laertis Economikos , Mukta Shaji Farooq , Michael Ford McAllister , Eric Daniel Perfecto , Chandrika Prasad , Keshav Prasad , Madhavan Swaminathan , Thomas Anthony Wassick , George White
- 申请人： Laertis Economikos , Mukta Shaji Farooq , Michael Ford McAllister , Eric Daniel Perfecto , Chandrika Prasad , Keshav Prasad , Madhavan Swaminathan , Thomas Anthony Wassick , George White
- 主分类号： H05K103
- IPC分类号： H05K103
摘要：
A thin film wiring scheme on a substrate. The thin film wiring scheme includes a plurality of chip connection pads at each of a first and second chip site on the substrate, a plurality of directional wiring lines interspersed between the chip connection pads at each of the first and second chip sites, at least one of the directional wiring lines being orthogonal to at least one of the other directional wiring lines at each of the first and second chip sites, and a plurality of chip site interconnection lines connecting directional wiring lines at the first chip site with the directional wiring lines at the second chip site.
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