- 专利标题: Method of manufacturing nitride semiconductor substrate
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申请号: US10062512申请日: 2002-02-05
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公开(公告)号: US06562701B2公开(公告)日: 2003-05-13
- 发明人: Masahiro Ishida , Daisuke Ueda , Masaaki Yuri
- 申请人: Masahiro Ishida , Daisuke Ueda , Masaaki Yuri
- 优先权: JP2001-084807 20010323; JP2001-084808 20010323
- 主分类号: H01L21302
- IPC分类号: H01L21302
摘要:
A mask film of a material on which substantially no nitride semiconductor grows and having a plurality of openings in a stripe shape is formed on a main surface of a base substrate. Then, on the base substrate, a semiconductor layer of nitride is selectively grown through the mask film. Then, a laser beam is irradiated upon the interface between the semiconductor layer and the base substrate to separate the semiconductor layer from the base substrate, so that a nitride semiconductor substrate is formed from the semiconductor layer.
公开/授权文献
- US20020137342A1 Method of manufacturing nitride semiconductor substrate 公开/授权日:2002-09-26
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