Semiconductor substrate, semiconductor device and method of manufacturing the same
    3.
    发明授权
    Semiconductor substrate, semiconductor device and method of manufacturing the same 失效
    半导体衬底,半导体器件及其制造方法

    公开(公告)号:US06593159B1

    公开(公告)日:2003-07-15

    申请号:US09532063

    申请日:2000-03-21

    IPC分类号: H01L2100

    摘要: A sapphire substrate, a buffer layer of undoped GaN and a compound semiconductor crystal layer successively formed on the sapphire substrate together form a substrate of a light emitting diode. A first cladding layer of n-type GaN, an active layer of undoped In0.2Ga0.8N and a second cladding layer successively formed on the compound semiconductor crystal layer together form a device structure of the light emitting diode. On the second cladding layer, a p-type electrode is formed, and on the first cladding layer, an n-type electrode is formed. In a part of the sapphire substrate opposing the p-type electrode, a recess having a trapezoidal section is formed, so that the thickness of an upper portion of the sapphire substrate above the recess can be substantially equal to or smaller than the thickness of the compound semiconductor crystal layer.

    摘要翻译: 蓝宝石衬底,未掺杂GaN的缓冲层和连续形成在蓝宝石衬底上的化合物半导体晶体层一起形成发光二极管的衬底。 n型GaN的第一包层,未掺杂的In 0.2 Ga 0.8 N的有源层和连续形成在化合物半导体晶体层上的第二覆层一起形成发光二极管的器件结构。 在第二包层上形成p型电极,在第一包层上形成n型电极。 在与p型电极相对的蓝宝石衬底的一部分中,形成具有梯形截面的凹部,使得凹部上方的蓝宝石衬底的上部的厚度可以基本上等于或小于 化合物半导体晶体层。