Invention Grant
- Patent Title: Nonstick layer for a micromechanical component
- Patent Title (中): 用于微机械部件的不粘层
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Application No.: US09445374Application Date: 2000-03-02
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Publication No.: US06656368B2Publication Date: 2003-12-02
- Inventor: Martin Schoefthaler , Peter Hein , Helmut Skapa , Horst Muenzel
- Applicant: Martin Schoefthaler , Peter Hein , Helmut Skapa , Horst Muenzel
- Priority: DE19723766 19970606
- Main IPC: H01L2100
- IPC: H01L2100

Abstract:
A method for manufacturing micromechanical components, and a micromechanical component, in which a movable element is produced on a sacrificial layer. In a subsequent step the sacrificial layer beneath the movable element is removed so that the movable element becomes movable. After removal of the sacrificial layer, a protective layer is deposited on a surface of the movable element. Silicon oxide and/or silicon nitride is used for the protective layer.
Public/Granted literature
- US20030139040A1 NONSTICK LAYER FOR A MICROMECHANICAL COMPONENT Public/Granted day:2003-07-24
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