- 专利标题: Apparatus for processing samples
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申请号: US09847406申请日: 2001-05-03
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公开(公告)号: US06656846B2公开(公告)日: 2003-12-02
- 发明人: Masayuki Kojima , Yoshimi Torii , Michimasa Hunabashi , Kazuyuki Suko , Takashi Yamada , Keizo Kuroiwa , Kazuo Nojiri , Yoshiaki Sato , Ryooji Fukuyama , Hironobu Kawahara
- 申请人: Masayuki Kojima , Yoshimi Torii , Michimasa Hunabashi , Kazuyuki Suko , Takashi Yamada , Keizo Kuroiwa , Kazuo Nojiri , Yoshiaki Sato , Ryooji Fukuyama , Hironobu Kawahara
- 优先权: JP1-42976 19890227; JP4-17997 19920204
- 主分类号: H01L213065
- IPC分类号: H01L213065
摘要:
Disclosed is apparatus for treating samples, and a method of using the apparatus. The apparatus includes processing apparatus (a) for treating the samples (e.g., plasma etching apparatus), (b) for removing residual corrosive compounds formed by the sample treatment, (c) for wet-processing of the samples and (d) for dry-processing the samples. A plurality of wet-processing treatments of a sample can be performed. The wet-processing apparatus can include a plurality of wet-processing stations. The samples can either be passed in series through the plurality of wet-processing stations, or can be passed in parallel through the wet-processing stations.
公开/授权文献
- US20020043340A1 Apparatus for processing samples 公开/授权日:2002-04-18