Invention Grant
- Patent Title: Flip-chip type semiconductor device
- Patent Title (中): 倒装型半导体器件
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Application No.: US10350110Application Date: 2003-01-24
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Publication No.: US06794058B2Publication Date: 2004-09-21
- Inventor: Tsuyoshi Honda , Tatsuya Kanamaru , Eiichi Asano , Toshio Shiobara
- Applicant: Tsuyoshi Honda , Tatsuya Kanamaru , Eiichi Asano , Toshio Shiobara
- Priority: JP2000-276231 20000912
- Main IPC: H01L2912
- IPC: H01L2912
Abstract:
A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i): wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ( n A 2 + n C 2 ) - ( n A + n C ) 2 } / 2 ] 1 / 2
Public/Granted literature
- US20030144382A1 Flip-chip type semiconductor device Public/Granted day:2003-07-31
Information query
