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公开(公告)号：US06794058B2
公开(公告)日：2004-09-21
申请号：US10350110
申请日：2003-01-24
IPC分类号： H01L2912
CPC分类号： C08K3/22 , C08K3/36 , C08K2003/2237 , Y10T428/12528 , C08L63/00
摘要： A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i): wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ( n A 2 + n C 2 ) - ( n A + n C ) 2 } / 2 ] 1 / 2
摘要翻译： 一种用透光性环氧树脂组合物密封的倒装芯片型半导体器件，其包含（A）具有以下通式（i）的环氧树脂：其中n为0或正数，（B）固化促进剂和（C ）无定形二氧化硅 - 二氧化钛共熔体作为无机填料中的至少一种，所述组合物满足下式（1）的关系：其中nA是组合物的固化产物在25℃以下的折射率，不包括 无机填料，nC是25℃下的无机填料的折射率。
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公开(公告)号：US06627328B2
公开(公告)日：2003-09-30
申请号：US09950737
申请日：2001-09-13
IPC分类号： H01L2912
CPC分类号： C08L63/00 , Y10T428/12528 , Y10T428/31511
摘要： An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½
摘要翻译： 包含（A）环氧树脂，（B）固化促进剂和（C）无机填料的环氧树脂组合物当满足式（1）和（2）时是透光的：其中nA是在T1° 固化的未填充组合物的c为n C为无机填料的T1℃的折射率，fA为固化的未填充组合物的折射率的温度系数，f C为折射率的温度系数 无机填料。 固化的组合物在宽温度范围内具有改善的耐热性，耐湿性和低应力以及高透明度。 该组合物适用于光学半导体器件的密封。
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3.发明授权Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith 有权硅氧烷改性的环氧树脂或酚醛树脂组合物和与其密封的半导体器件公开(公告)号：US06709753B2
公开(公告)日：2004-03-23
申请号：US10079495
申请日：2002-02-22
IPC分类号： B32B2742
CPC分类号： H01L23/293 , C08G59/306 , C08G59/3254 , C08G77/42 , C08G81/00 , C08L61/06 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , Y10T428/31663 , C08L83/00 , H01L2924/00
摘要： A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.
摘要翻译： 提供一种树脂组合物，其包含通过具有特定结构单元的环氧树脂或酚醛树脂与有机聚硅氧烷反应而获得的硅氧烷改性环氧树脂或酚醛树脂。 改性环氧树脂或酚醛树脂使得在改性环氧树脂或酚醛树脂单独或与另一种环氧树脂和/或酚醛树脂一起固化以形成固化产物后，有机聚硅氧烷组分在固化产物中不形成相分离结构 。 该组合物固化成具有环氧树脂或酚醛树脂的粘附性，耐热性和耐湿性特性以及有机硅树脂的柔韧性和耐冲击性特性的产品。
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公开(公告)号：US06733902B2
公开(公告)日：2004-05-11
申请号：US10218625
申请日：2002-08-15
IPC分类号： H01L2912
CPC分类号： H01L24/31 , C08G59/306 , C08G59/3254 , C08L63/00 , H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/73203 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/3512 , H01L2924/00
摘要： A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.
摘要翻译： 液体环氧树脂组合物包括（A）液体环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料和（E）由 含有烯基的环氧树脂或酚醛树脂与有机聚硅氧烷，液态环氧树脂组合物固化成Tg为30-120℃的产物和特定的动态粘弹性行为。 该组合物粘附于硅片，该固化产品对热和热冲击具有高度的抗性，并且该组合物可用作倒装芯片型半导体器件的密封剂。
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公开(公告)号：US08110066B2
公开(公告)日：2012-02-07
申请号：US12213003
申请日：2008-06-12
申请人： Tatsuya Kanamaru , Tsuyoshi Honda
发明人： Tatsuya Kanamaru , Tsuyoshi Honda
CPC分类号： C09J163/00 , C08K3/013 , C08L83/04 , C08L2666/54 , H01L2224/274 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/83885 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 μm. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.
摘要翻译： 一种粘合剂组合物，其包含（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料，（E）在25℃下为固体的热塑性树脂颗粒，和 （F）通过激光光衍射法测定的累积50％（d50）的粒径为1〜50μm的硅酮粉末。 该组合物特别适用于通过丝网印刷施加在基底或硅晶片上。
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公开(公告)号：US20080308225A1
公开(公告)日：2008-12-18
申请号：US12213003
申请日：2008-06-12
申请人： Tatsuya Kanamaru , Tsuyoshi Honda
发明人： Tatsuya Kanamaru , Tsuyoshi Honda
IPC分类号： C09J5/06 , C08K5/5415 , C08L63/00
CPC分类号： C09J163/00 , C08K3/013 , C08L83/04 , C08L2666/54 , H01L2224/274 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/83885 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： An adhesive composition comprising(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) an inorganic filler,(E) particles of a thermoplastic resin which is solid at 25° C., and(F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 μm.The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.
摘要翻译： 一种粘合剂组合物，其包含（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料，（E）在25℃下为固体的热塑性树脂颗粒，和 （F）通过激光光衍射法测定的粒径为50％（d50）的硅酮粉末为1〜50μm。 该组合物特别适用于通过丝网印刷施加在基底或硅晶片上。
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7.发明授权Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof 有权环氧树脂组合物，使用其的管芯附着方法，以及含有其固化物的半导体装置公开(公告)号：US08815400B2
公开(公告)日：2014-08-26
申请号：US13351484
申请日：2012-01-17
IPC分类号： B32B27/38 , H01L23/14 , H01L21/78 , C09J163/00 , C08G59/24 , C08G59/30 , C08G59/32 , C08G59/62 , C08L63/00 , H01L23/00 , H01L23/29 , C08K5/103 , C08K5/5419
CPC分类号： H01L23/296 , C08G59/621 , C08K5/103 , C08K5/5419 , C08L63/00 , H01L24/29 , H01L2924/10253 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 μm, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.
摘要翻译： 环氧树脂组合物，其包含（A）环氧树脂，其在室温下为固体且软化点为40℃至110℃，（B）固化剂，其在室温下为固体并具有软化点 不低于40℃至110℃，（C）固化促进剂，（D）质量平均粒径为0.05至5μm的无机填料，（E）稀释剂和（F） 提供其中组分（A）和组分（B）中的至少一种是有机硅改性的特定的二甲基硅氧烷。 该组合物可以以硅芯片贴片方法使用，或者制造含有硅芯片，基板和该组合物的固化物的半导体器件，其中硅芯片经由固化产物与基板结合。
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公开(公告)号：US4897317A
公开(公告)日：1990-01-30
申请号：US174830
申请日：1988-03-29
CPC分类号： C25D5/10 , C25D15/02 , C25D3/565 , Y10T428/1259 , Y10T428/12799
摘要： A plated steel strip having an enhanced corrosion and rust resistance and an improved paint-coating property comprises a principal plating layer formed on a steel strip substrate and comprising a co-deposited zinc-chromium based alloy which comprises more than 5% by weight but not more than 40% by weight of chromium and the balance of zinc.
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公开(公告)号：US4877494A
公开(公告)日：1989-10-31
申请号：US320071
申请日：1989-03-07
CPC分类号： C25D5/10 , C25D15/02 , C25D3/565 , Y10T428/1259 , Y10T428/12799
摘要： A plated steel strip having an enhanced corrosion and rust resistance and an improved paint-coating property comprises a principal plating layer formed on a steel strip substrate and comprising a co-deposited zinc-chromium based alloy which comprises more than 5% by weight but not more than 40% by weight of chromium and the balance of zinc.
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公开(公告)号：US4256519A
公开(公告)日：1981-03-17
申请号：US32882
申请日：1979-04-24
CPC分类号： C21D9/563
摘要： A method of and an apparatus for overaging treatment of low melting point-metal plated steel band, in which a hearth roll having surface layer which consists mainly of phenol resin, mineral fiber and small quantity of additive as necessary is used under the overaging treatment temperature range and within weak oxidation, inactive or reducing high temperature gas atmosphere such that the phenol resin substantially does not oxidize and evaporate.The method and apparatus allow overaging treatment of low melting point-metal plated steel band in continuous annealing furnace having many hearth rolls to guide the steel band, and prevent the low melting point metal from being picked up on the surface of the hearth roll.
摘要翻译： 低熔点镀金钢带的过时效处理方法和装置，其中在过时效处理温度下使用具有主要由酚醛树脂，矿物纤维和少量添加剂组成的表面层的炉床辊 在弱氧化，无活性或还原的高温气体气氛中，使得酚醛树脂基本上不氧化和蒸发。 该方法和装置允许在具有许多炉床的连续退火炉中对低熔点金属镀钢钢带进行过时效处理，以引导钢带，并且防止低熔点金属被拾取在炉床辊的表面上。
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