发明授权
- 专利标题： Flip-chip type semiconductor device
- 专利标题（中）： 倒装型半导体器件
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申请号： US10350110申请日： 2003-01-24
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公开(公告)号： US06794058B2公开(公告)日： 2004-09-21
- 发明人: Tsuyoshi Honda , Tatsuya Kanamaru , Eiichi Asano , Toshio Shiobara
- 申请人： Tsuyoshi Honda , Tatsuya Kanamaru , Eiichi Asano , Toshio Shiobara
- 优先权： JP2000-276231 20000912
- 主分类号： H01L2912
- IPC分类号： H01L2912
摘要：
A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i): wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ( n A 2 + n C 2 ) - ( n A + n C ) 2 } / 2 ] 1 / 2
公开/授权文献
- US20030144382A1 Flip-chip type semiconductor device 公开/授权日：2003-07-31
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