发明授权
- 专利标题： Endpoint detection for electro chemical mechanical polishing and electropolishing processes
- 专利标题（中）： 电化学机械抛光和电解抛光工艺的端点检测
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申请号： US10056316申请日： 2002-01-22
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公开(公告)号： US06837983B2公开(公告)日： 2005-01-04
- 发明人: Alain Duboust , Yan Wang , Siew Neo , Liang-Yuh Chen
- 申请人： Alain Duboust , Yan Wang , Siew Neo , Liang-Yuh Chen
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Moser, Patterson & Sheridan
- 主分类号： B23H5/08
- IPC分类号： B23H5/08 ; B24B37/013 ; B24B49/04 ; B24B49/10 ; C25F7/00 ; H01L21/304 ; H01L21/3063 ; C25F3/00 ; C22D17/00
摘要：
Systems and methods for detecting the endpoint of a polishing step. In general, an electropolishing system is provided with a power supply configured to deliver a current through an electrolytic solution. Signal characteristics of the signal provided by the power supply are monitored to determine a polishing endpoint. Illustratively, the monitored signal characteristics include current and voltage.
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