发明授权
- 专利标题: High breakdown voltage CMOS device
- 专利标题(中): 高击穿电压CMOS器件
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申请号: US10329643申请日: 2002-12-26
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公开(公告)号: US06864543B2公开(公告)日: 2005-03-08
- 发明人: Satoru Kaneko , Toshiyuki Ohkoda , Takao Myono
- 申请人: Satoru Kaneko , Toshiyuki Ohkoda , Takao Myono
- 申请人地址: JP Osaka
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Fish & Richardson P.C.
- 优先权: JP2001-401189 20011228
- 主分类号: H01L27/04
- IPC分类号: H01L27/04 ; H01L21/822 ; H01L21/8249 ; H01L27/02 ; H01L27/06 ; H01L27/08 ; H01L27/092 ; H02M3/07 ; H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113
摘要:
A semiconductor device for a charge pump device suitable for providing large current capacity and preventing a latch up from occurring is offered. A first and a second N-type epitaxial silicon layers are stacked on a P-type single crystalline silicon substrate, and a P-type well region is formed in the second epitaxial silicon layer. A P+-type buried layer is formed abutting on a bottom of the P-type well region, and an MOS transistor is formed in the P-type well region. The MOS transistor has a first source layer N+S of high impurity concentration, a first drain layer N+D of high impurity concentration and a second source layer N−S and/or a second drain layer N−D of low impurity concentration, which is diffused deeper than the first source layer N+S of high impurity concentration and the first drain layer N+D of high impurity concentration.
公开/授权文献
- US20030141530A1 Semiconductor device and manufacturing method thereof 公开/授权日:2003-07-31
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