- 专利标题: Electrostatic discharge protection device and method of manufacturing the same
-
申请号: US10230055申请日: 2002-08-29
-
公开(公告)号: US06882009B2公开(公告)日: 2005-04-19
- 发明人: Ming-Dou Ker , Tang-Kui Tseng , Hsin-Chin Jiang , Chyh-Yih Chang , Jeng-Jie Peng
- 申请人: Ming-Dou Ker , Tang-Kui Tseng , Hsin-Chin Jiang , Chyh-Yih Chang , Jeng-Jie Peng
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 主分类号: H01L21/265
- IPC分类号: H01L21/265 ; H01L21/8234 ; H01L27/02 ; H01L27/07 ; H01L29/10 ; H01L21/01 ; H01L23/62
摘要:
An electrostatic discharge protection device that includes a semiconductor substrate of a first dopant type, at least one source/drain pair of a second dopant type formed in the substrate, wherein the source/drain pair is separated to define a channel region therebetween, a lightly-doped region of the first dopant type defined between the source/drain pair and including at least a portion of the channel region, a gate dielectric layer formed over the substrate, and a gate formed over the gate dielectric layer and above the channel region.
公开/授权文献
信息查询
IPC分类: