Invention Grant
- Patent Title: Electrostatic discharge protection device and method of manufacturing the same
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Application No.: US10230055Application Date: 2002-08-29
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Publication No.: US06882009B2Publication Date: 2005-04-19
- Inventor: Ming-Dou Ker , Tang-Kui Tseng , Hsin-Chin Jiang , Chyh-Yih Chang , Jeng-Jie Peng
- Applicant: Ming-Dou Ker , Tang-Kui Tseng , Hsin-Chin Jiang , Chyh-Yih Chang , Jeng-Jie Peng
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L21/8234 ; H01L27/02 ; H01L27/07 ; H01L29/10 ; H01L21/01 ; H01L23/62

Abstract:
An electrostatic discharge protection device that includes a semiconductor substrate of a first dopant type, at least one source/drain pair of a second dopant type formed in the substrate, wherein the source/drain pair is separated to define a channel region therebetween, a lightly-doped region of the first dopant type defined between the source/drain pair and including at least a portion of the channel region, a gate dielectric layer formed over the substrate, and a gate formed over the gate dielectric layer and above the channel region.
Public/Granted literature
- US20040043568A1 Electrostatic discharge protection device and method of manufacturing the same Public/Granted day:2004-03-04
Information query
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